<instructions>Your goal is to analyze the following comment and estimate how highly it will be upvoted by the Hacker News community.</instructions><comment><author>emacs28</author><text>CCX stands for Core Complex&lt;p&gt;CCD stands for Core Complex Die (and neither terms refer to the IO die)</text><parent_chain><item><author>rektide</author><text>AMD has done extremely well with multi-chip(let) modules. Zen cores &amp;amp; zen clusters (on Core Chiplet Die, CCD) are wonderfully small, and a huge amount of the regular stuff cores do is relegated to the IO Die (CCX), which is not as cutting edge.&lt;p&gt;But wow there&amp;#x27;s a bunch of power burned on interconnect between CCDs and CCX. And now AMD&amp;#x27;s new southbridge, Promontory 21, made by Asmedia, is another pretty significant power hog, and the flagship X670 tier is powered by two of these.&lt;p&gt;There&amp;#x27;s absolutely a challenge to bring power down. I&amp;#x27;m incredibly super impressed by AMD&amp;#x27;s showing, &amp;amp; they&amp;#x27;ve done very well. But they&amp;#x27;ve been making trade-offs that have pretty large net impacts, especially if we measure at idle power.</text></item></parent_chain></comment><story><title>AMD CEO: The Next Challenge Is Energy Efficiency</title><url>https://spectrum.ieee.org/amd-eyes-supercomputer-efficiency-gains</url></story>
<instructions>Your goal is to analyze the following comment and estimate how highly it will be upvoted by the Hacker News community.</instructions><comment><author>MrBuddyCasino</author><text>Manufacturing costs force them to go down the chiplet path. Its actually impressive they can remain competitive at all given TSMCs margin of 67%. [0]
If Intel Foundry manages to keep up with TSMC, thats a lot of pricing power advantage over AMD. Or they could make lower-power CPUs that would be uneconomical for AMD.&lt;p&gt;[0] &lt;a href=&quot;https:&amp;#x2F;&amp;#x2F;www.macrotrends.net&amp;#x2F;stocks&amp;#x2F;charts&amp;#x2F;TSM&amp;#x2F;taiwan-semiconductor-manufacturing&amp;#x2F;ebitda-margin&quot; rel=&quot;nofollow&quot;&gt;https:&amp;#x2F;&amp;#x2F;www.macrotrends.net&amp;#x2F;stocks&amp;#x2F;charts&amp;#x2F;TSM&amp;#x2F;taiwan-semicon...&lt;/a&gt;</text><parent_chain><item><author>rektide</author><text>AMD has done extremely well with multi-chip(let) modules. Zen cores &amp;amp; zen clusters (on Core Chiplet Die, CCD) are wonderfully small, and a huge amount of the regular stuff cores do is relegated to the IO Die (CCX), which is not as cutting edge.&lt;p&gt;But wow there&amp;#x27;s a bunch of power burned on interconnect between CCDs and CCX. And now AMD&amp;#x27;s new southbridge, Promontory 21, made by Asmedia, is another pretty significant power hog, and the flagship X670 tier is powered by two of these.&lt;p&gt;There&amp;#x27;s absolutely a challenge to bring power down. I&amp;#x27;m incredibly super impressed by AMD&amp;#x27;s showing, &amp;amp; they&amp;#x27;ve done very well. But they&amp;#x27;ve been making trade-offs that have pretty large net impacts, especially if we measure at idle power.</text></item></parent_chain></comment><story><title>AMD CEO: The Next Challenge Is Energy Efficiency</title><url>https://spectrum.ieee.org/amd-eyes-supercomputer-efficiency-gains</url></story>