One woman is about to discover everything she believes-knows-to be true about her life.isn't. After hitting her head, Lucy Sparks awakens in the hospital to a shocking revelation: the man she's known and loved for years-the man she recently married-is not actually her husband. In fact, they haven't even spoken since their breakup four years earlier. The happily-ever-after she remembers in vivid detail-right down to the dress she wore to their wedding-is only one example of what her doctors call a false memory: recollections Lucy's mind made up to fill in the blanks from the coma. Her psychologist explains the condition as honest lying, because while Lucy's memories are false, they still feel incredibly real. Now she has no idea which memories she can trust-a devastating experience not only for Lucy, but also for her family, friends and especially her devoted boyfriend, Matt, whom Lucy remembers merely as a work colleague. When the life Lucy believes she had slams against the reality she's been living for the past four years, she must make a difficult choice about which life she wants to lead, and who she really is.


There are many decisions that you can expect to make in your travel plans. Sometimes that preparation is part of the fun of the trip. This article has many helpful hints and pointers on making traveling arrangements and plans to help you stay focused on the fun and less on the stress.
When making a long journey on a plane, you should pack along some non-liquid snacks of your own. Fresh snacks, especially a juicy apple, sweet strawberries or plump grapes, will break up your voyage and be a welcome change to the heavy airplane food that sits like a brick, inside your stomach. Not only will you save a bundle by not buying that expensive airport food, but you will have a great conversation opener with any nice-looking neighbor, eyeing your snacks!
Plan your daily activities before you leave for your destination. By planning ahead, you will not feel overwhelmed each day trying to figure out what to do. Look online for things to do and if required, make your reservations for these activities ahead of time. This ensures that each day will go as planned!
Anyway, will you be interested to understand more information on Thailand resorts? In that case go to Richard G. Sukhum's website today to read more about Thailand luxury resorts.
David Lieberman is a technology investor and advisor, helping companies with their projects and websites. He is also a founding member and president of Planetofhotels, an upcoming leader in hotel reservation services.


text:
Anatomy of a Love Seen es una película dramática-romántica americana del año 2014 escrita y dirigida por Marina Rice Bader y protagonizada por Sharon Hinnendael y Jill Evyn.

Trama
La película gira en torno a dos jóvenes actrices que se enamoran mientras graban una escena de amor lésbica. Meses después rompen su relación pero se ven forzadas a volver a reunirse para volver a grabar la escena de amor para la distribución de la película.

Reparto
 Sharon Hinnendael como Zoe Peterson.
 Jill Evyn como Mal Ford.
 Constance Brenneman como Anne Pasternak.
 Marina Rice Bader como Kara Voss.
 Kieran Valla como Kieran Scardovi.

Películas con temática LGBT de 2014

redpajama_set_name: RedPajamaWikipedia


text:
Topics » Epilepsy
National Registry to Aid Sudden Unexpected Death in Epilepsy Research
Nicole Blazek
Cases of sudden unexpected death in epilepsy (SUDEP) are not currently routinely or systematically reported in the United States making it difficult to elucidate risk factors for the condition. But this is about to change, according to the National Institutes of Health and the CDC.
The two agencies are collaborating to create the Sudden Death in the Young Registry. The registry will use comprehensive data on each recorded case of sudden death in infants, children, and individuals aged up to 24 years related to epilepsy and heart disease in 10 states and major metropolitan areas to estimate national incidence rates, the agencies announced in joint press release.
The 10 grantees will begin reviewing cases January 2015, and will enter findings from death scene investigations, medical records, autopsy reports, and other pertinent data sources for each case into a database managed by the Michigan Public Health Institute. DNA samples from the cases will be stored at a centralized bio-repository.
Regions participating in Sudden Death in the Young Registry and Sudden Unexpected Infant Death Registry. Image courtesy of CDC.
"[This] is a critical first step toward figuring out how to best prevent these tragedies," said Jonathan Kaltman, MD,chief of the Heart Development and Structural Diseases Branch within the Division of Cardiovascular Sciences at the NIH's National Heart, Lung, and Blood Institute (NHLBI).
The public health agencies chosen to participate in the registry include Delaware, Georgia, Michigan, Minnesota, New Hampshire, New Jersey, the city of San Francisco, the Tidewater region of Virginia, Tennessee, and Wisconsin.
The National Institute for Neurological Disorders and Stroke (NINDS) will review data on SUDEP, whereas NHLBI will analyze data related to sudden cardiac death. The resulting registry will become a resource for scientists to learn more about the causes of sudden death in the young and ultimately to develop better diagnostic and prevention approaches, according to the NIH and CDC.
The program is an expansion of the CDC's Sudden Unexpected Infant Death Case Registry, which currently tracks sudden unexpected deaths in children up to age 1 in nine states.
Epilepsy General Neurology
Emerging Biomarkers of Sudden Unexpected Death in Epilepsy (SUDEP)
Patients with Severe Epilepsy More Aware of SUDEP
Next post in Epilepsy
Close more info about National Registry to Aid Sudden Unexpected Death in Epilepsy Research

redpajama_set_name: RedPajamaCommonCrawl


text:
US9606589B2 - Expansion card having synergistic cooling, structural and volume reduction solutions - Google Patents
Expansion card having synergistic cooling, structural and volume reduction solutions Download PDF
board assembly
Mark J. Gallina
Jason B. Chesser
Mike G. MacGregor
Mark J. Luckeroth
Brian S. Jarrett
Thu Huynh
Eric D. McAfee
Barrett M. Faneuf
Michelle Goeppinger
2011-11-29 Application filed by Intel Corp filed Critical Intel Corp
2011-11-29 Priority to PCT/US2011/062447 priority Critical patent/WO2013081585A1/en
2014-07-21 Assigned to INTEL CORPORATION reassignment INTEL CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MACGREGOR, MIKE G., GALLINA, MARK J., HANCOCK, MICHELLE, CHESSER, JASON B., HUYNH, THU, FANEUF, BARRETT M., JARRETT, BRIAN S., LUCKEROTH, Mark J., MCAFEE, ERIC D.
G06F1/00—Details not covered by groups G06F3/00 – G06F13/00 and G06F21/00
G06F1/16—Constructional details or arrangements
G06F1/20—Cooling means
G06F1/18—Packaging or power distribution
G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
G06F1/185—Mounting of expansion boards
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K7/00—Constructional details common to different types of electric apparatus
H05K7/20—Modifications to facilitate cooling, ventilating, or heating
H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
H05K7/20136—Forced ventilation, e.g. by fans
H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28—HEAT EXCHANGE IN GENERAL
F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
Systems and methods of fabricating circuit board assemblies may provide for a circuit board assembly that includes an expansion card having a first side and a second side, a first set of semiconductor packages coupled to the first side and a second set of semiconductor packages coupled to the second side. The circuit board assembly may also include a synergistic combination of cooling solutions for the expansion card such as a metallic duct, centrifugal fan or secondary plate, structural solutions for the expansion card such as a clamp structure or retention interlock, and volume reduction solutions for the expansion card such as one or more flipped power connectors.
Embodiments generally relate to expansion cards. More particularly, embodiments relate to expansion card configurations that have synergistic cooling, structural and volume reduction solutions.
Expansion cards such as graphics cards and throughput cards may be used to expand the computing power of systems, wherein a typical expansion card may be connected to a mother board of a system via a PHI-e (Peripheral Components Interconnect Express, e.g., PHI Express x16 Graphics 150W-TAX Specification 1.0, PHI Special Interest Group) connector mounted to the mother board. As the computing power of certain expansion cards may increase, the addition of heat sinks and other cooling solutions to the cards may be needed in order dissipate heat generated by card components. Certain cooling solutions, however, may be relatively large and heavy, which can lead to concerns with regard to shock resistance (e.g., if the system is dropped during shipment). Moreover, trends toward smaller computing systems may limit the amount of available volume to be dedicated to cooling solutions.
The various advantages of the embodiments of the present invention will become apparent to one skilled in the art by reading the following specification and appended claims, and by referencing the following drawings, in which:
FIG. 1A is a perspective view of an example a front side of an expansion card according to an embodiment;
FIG. 1B is a perspective view of an example of a back side of an expansion card according to an embodiment;
FIG. 2 is a block diagram of an example of an expansion card according to an embodiment;
FIG. 3 is a perspective view of an example of a metallic duct according to an embodiment;
FIG. 4 is an exploded perspective view of an example of a circuit board assembly having a metallic duct according to an embodiment;
FIG. 5 is a plan view of an example of an expansion card and a metallic duct according to an embodiment;
FIG. 6 is a sectional view of an example of a circuit board assembly having a metallic duct with cooling fins according to an embodiment;
FIGS. 7A and 7B are sectional views of examples of direct thermal connections between metallic duct flange surfaces and semiconductor packages according to an embodiment;
FIG. 8 is a sectional view of an example of a clamp structure according to an embodiment;
FIG. 9 is an enlarged sectional view of an example of a clamp structure according to an embodiment;
FIGS. 10A-10D are illustrations of examples of deflection and stress measurements associated with a clamp structure according to an embodiment;
FIG. 11 is a perspective view of an example of a clamp structure having a clamp slot according to an embodiment;
FIGS. 12A-12C are cross-sectional views taken along lines 12A-12A to 12C-12C, respectively, in FIG. 11;
FIGS. 13A and 13B are exploded perspective views of a front side and a back side, respectively, of an example of a circuit board assembly having a secondary plate according to an embodiment;
FIGS. 14A and 14B are perspective views of back side and front side, respectively, of an example of a secondary plate according to an embodiment;
FIG. 15 is an enlarged sectional view of an example of a direct thermal connection between a front side heat pipe and a back side heat pipe according to an embodiment;
FIGS. 16A and 16B are perspective and plan views, respectively, of an example of a centrifugal fan impeller wheel according to an embodiment;
FIG. 17 is a cross-sectional view taken along lines 17-17 in FIG. 16 according to an embodiment;
FIG. 18 is a plot of an example of fan blade curvature envelopes according to an embodiment;
FIG. 19 is a plot of an example of airflow versus blade count according to an embodiment;
FIG. 20 is a perspective view of an example of a power connector according to an embodiment;
FIGS. 21A and 21B are front and back perspective views, respectively, of an example of a mating arrangement between a power connector and a plug according to an embodiment;
FIG. 22 is a side sectional view of an example of a mating arrangement between a power connector and a plug according to an embodiment;
FIG. 23 is a perspective view of an example of a mother board having a retention clip according to an embodiment;
FIG. 24 is an enlarged perspective view of an example of a retention clip according to an embodiment;
FIG. 25 is a perspective view of an example of an interlock and card bracket assembly according to an embodiment;
FIG. 26 is a perspective view of an example of an interlock and card bracket assembly prior to connection with a mother board according to an embodiment;
FIG. 27 is a perspective view of an example of an interlock and card bracket assembly after connection with a mother board according to an embodiment;
FIG. 28 is an enlarged view of an example of a fan interlock assembly according to an embodiment; and
FIG. 29 is a plot of an example of shock risk versus dynamic load for a circuit board assembly having a retention mechanism according to an embodiment.
Embodiments may include a circuit board assembly having an expansion card with a first side and a second side, and a first set of semiconductor packages coupled to the first side of the expansion card. The circuit board assembly can also include a metallic duct coupled to the first side of the expansion card. The metallic duct may include one or more flange surfaces having a direct thermal connection with one or more of the first set of semiconductor packages.
Embodiments may also include a circuit board assembly having an expansion card with a first side and a second side, and a first set of semiconductor packages coupled to the first side of the expansion card. A primary clamp structure may be coupled to the first side of the expansion card, and a secondary clamp structure may be coupled to the second side of the expansion card. The primary clamp structure can include a front edge surface that contacts a peripheral portion of the first side of the expansion card and clamps the expansion card between the secondary clamp structure and the primary clamp structure.
In addition, embodiments can include a circuit board assembly having an expansion card with a first side and a second side. A first set of semiconductor packages may be coupled to the first side of the expansion card, and a second set of semiconductor packages may be coupled to the second side of the expansion card. The circuit board assembly can also include a first heat pipe coupled to the first side of the expansion card, and a secondary plate coupled to the second side of the expansion card, wherein the secondary plate has a direct thermal connection with one or more of the second set of semiconductor packages. The circuit board assembly may also include a second heat pipe coupled to the second side of the expansion card, wherein the second heat pipe has a direct thermal connection with the secondary plate. Moreover, the expansion card can include surfaces defining a pipe opening, wherein the first and second heat pipes contact one another through the pipe opening.
Other embodiments may include a circuit board assembly having an expansion card with a first side and a second side, and a centrifugal fan coupled to the first side of the expansion card. The centrifugal fan can include an impeller wheel having a plurality of blades, wherein each blade of the centrifugal fan includes one or more curved in board edges that have an inner radius of approximately 25 mm.
Additionally, embodiments may include a circuit board assembly having an expansion card is with a first side and a second side, and a power connector coupled to the first side of the expansion card adjacent to an edge of the expansion card. The power connector can include a plug retention mechanism disposed on the second side of the expansion card.
Embodiments may also include a circuit board assembly having an expansion card and a card bracket coupled to the expansion card, wherein the card bracket includes surfaces defining a longitudinal opening and surfaces defining a lateral opening. The circuit board assembly may also include an interlock disposed within the card bracket, wherein the interlock has a first member extending through the longitudinal opening and a second member extending through the lateral opening. A number of these embodiments may be combined with one another to achieve synergistic effects with regard to cooling, shock absorption and volume reduction.
Turning now to FIGS. 1A and 1B, front and back views of an expansion card 50 are shown, respectively. In general, the expansion card 50 might be used to perform, for example, processing intensive graphics and/or throughput (e.g., parallel) computing functions that support the operation of a larger computing system. The expansion card 50 may therefore have a slot installation edge 52 with contact pads that can be inserted into a corresponding connecting slot on a mother board (not shown). In the illustrated example, the front side of the expansion card 50 has a main processor/co-processor chip (e.g., semiconductor package, silicon die) 54 and a plurality of supporting components 56 such as, for example, memory chips, voltage regulator chips, etc., wherein the processor chip 54 and the supporting components 56 may generate heat during operation. The back side of the expansion card 50 may also include supporting components 58 that can generate heat during operation.
FIG. 2 demonstrates that the expansion card 50 may include one or more cooling solutions 60 that contribute to the overall weight and size of the card 50. For example, the cooling solutions 60 may include a heat sink coupled, via a direct thermal connection, to a heat generating surface of the main processor chip 54 (FIG. 1), wherein the heat sink may he relatively large. The cooling solutions 60 may also include other, more aggressive components to support higher computing power and associated heat generation, as will be discussed in greater detail. The illustrated cooling solutions 60, however, have a synergistic relationship with one or more structural solutions 62 and one or more volume reduction solutions 64 that minimizes the impact of the cooling solutions 60 on the weight, size and shock resistance of the card 50. Accordingly, the solutions 60, 62, 64 may enable the card 50 to conduct processing intensive, high power operations without concern over excessive heat generation or reduced shock resistance, even in a computing system having tight volume constraints.
In particular, the cooling solutions 60 may include a unique metallic duct, centrifugal fan and/or secondary plate, the volume reduction solutions 64 may include a unique power connector, and the structural solutions 62 may include a clamp structure and/or an retention interlock, wherein one or more of these components may function as multiple types of solutions (e.g., the metallic duct may function as a cooling solution and a structural solution, the secondary plate may function as a cooling solution and a volume reduction solution, and so forth). Moreover, one or more of these components can reinforce and/or enhance the positive impact of one or more of the other components. For example, a number of the components may enable the heat sink to be enlarged, which can provide for more aggressive cooling. Accordingly, the solutions 60, 62, 64 may he considered "synergistic".
Metallic Duct
Turning now to FIG. 3, a metallic duct 66 is shown. The illustrated metallic duct 66 has one or more flange surfaces such as a flange surface 68, which, if the duct 66 is mounted to the front side of an expansion card such as the card 50 (FIG. 1A), will have a direct thermal connection with one or more of the heat generating semiconductor packages also mounted to the first side of the card. Thus, the flange surface 68 might have a direct thermal connection with the supporting components 56 (FIG. 1A) near the slot installation edge 52 (FIG. 1A), in the example shown above. Accordingly, the duct 66 may have a "hot spot" 70 corresponding to a semiconductor package that generates a particularly high amount of heat during operation. Indeed, the metallic (e.g., aluminum) composition of the illustrated duct 66 makes it a good conductor of heat. When used in conjunction with an air moving device such as a centrifugal fan (discussed below), the duct 66 may control airflow directionality in a manner that channels heat away from the expansion card.
FIG. 4 shows an exploded view of a circuit board assembly 72 in which an expansion card 76 is sandwiched between a metallic duct 74 and a back plate 78. In the illustrated example, the metallic duct 74 includes peripheral flange surfaces 80 that have a direct thermal connection with semiconductor packages mounted near the periphery of the front side (not shown) of the expansion card 76, as well as "web" flange surfaces 82 that have a direct thermal connection with semiconductor packages mounted in the center portion of the front side (not shown) of the expansion card 76. The flange surfaces 80, 82 may include a thermal interface material (illustrated as squares and rectangles) such as, for example, a gap filler/pad or a curable liquid that enhances the thermal conductivity of the interface between the semiconductor packages and the flange surfaces 80, 82. The thermal interface material can also provide a resistive spring force to ensure tight coupling between components during assembly.
The illustrated circuit board assembly 72 also includes a heat sink 84 that slides into the metallic duct 74, which may have either a rectangular or "C-shaped" cross section, and makes direct thermal contact with a processor chip mounted to the front side (not shown) of the expansion card 76. A centrifugal fan 86 may also slide into the metallic duct 74, wherein the fan 86 may create airflow through the duct 74 and across the heat sink 84. Thus, the illustrated duct 74 is a unique cooling solution that controls airflow directionality away from the expansion card 76. In addition, the duct 74 may provide a structural solution in that it may function as a clamp to the expansion card 76 in order to prevent vibrations of the expansion card 76 if, for example, a computing system containing the circuit board assembly 72 is dropped during shipping.
FIG. 5 shows an enlarged view of a disassembled expansion card 88 and metallic duct 90. In the illustrated example, the front side of the expansion card 88 and the back side of the metallic duct 90 (i.e., the interacting faces), are shown. The metallic duct 90 may have a peripheral flange surface 92 that has a direct thermal connection with a set of peripherally mounted chips 94 after assembly, and a peripheral flange surface 96 that has a direct thermal connection with a set of peripherally mounted chips 98 after assembly. In addition, the metallic duct 90 can have web flange surfaces 100, 102, 104 and 106 that have direct thermal connections with sets of internally mounted chips 108, 110, 112, and 114, respectively. As already noted, the peripherally mounted chips 94, 98 and/or the internally mounted chips 108, 110, 112, 114, may include memory such as GDDR (graphics double data rate, e.g., Synchronous Dynamic Random Access Memory/SDRAM, DDR3 SDRAM JEDEC Standard JESD79-3C, April 2008), voltage regulators, and so forth.
FIG. 6 shows a sectional view of a circuit board assembly 116 having a metallic duct 118 with a first set of cooling fins 120 coupled to an internal surface of the metallic duct 118 and second set of cooling fins 122 coupled to an external surface of the metallic duct 118. The cooling fins 120, 122, may be extruded from the same piece of material used for the duct 118, or stamped and coupled to the surfaces of the duct 118 via a suitable adhesion compound, weld, solder, etc. The cooling fins 120, 122 can further enhance the ability of the metallic duct 118 to dissipate the heat generated by the chips mounted to the expansion card.
FIGS. 7A and 7B show an expansion card 126 having a chip 124 mounted thereon (e.g., via ball grid array/BGA technology), wherein the chip 124 has a direct thermal connection with a peripheral flange surface 128 of a metallic duct 130. At least a portion of the heat generated by the illustrated chip 124 is conducted through a wall 132 of the metallic duct 130 and into the ambient air. A heat pipe 134 may also be coupled to another side of the peripheral flange surface 128, wherein the heat pipe 134 can carry heat away from the chip 124 and to another cooling system component such as a heat sink 136.
The illustrated approach may therefore dissipate heat from supporting components, wherein such dissipation can enable the heat sink coupled to the main processor to be enlarged. Indeed, larger heat sinks may in turn enable higher processing speeds and enhanced performance. Moreover, the illustrated approach may provide stiffness to expansion cards, protect the structural integrity of BGA packages, and provide a mechanism for directing and controlling the airflow through the card's primary cooling solution (e.g., main processor heat sink).
Clamp Structure
As already noted, a metallic duct may be used to provide structural support to expansion cards. FIGS. 8 and 9 demonstrate that a clamp structure may also be used for structural support, wherein the clamp structure can be deployed in addition to, or instead of a metallic duct. In the illustrated example, a primary clamp structure 138 is coupled to the front side of an expansion card 140 and a secondary clamp structure 142 is coupled to the back side of the expansion card 140. In particular, the enlarged view of region 144 shows that the primary clamp structure 138 may include a top edge surface 146 that contacts a peripheral portion of the front side of the expansion card 140 and clamps the expansion card 140 between the secondary clamp structure 142 and the primary clamp structure 130. The illustrated primary clamp structure 138 is an integral piece that extends around the perimeter of the expansion card 140, although other configurations may he used. For example, the primary clamp structure 138 may include a metallic duct (not shown) having a top edge surface that contacts the peripheral portion of the from side of the expansion card 140 and clamps the expansion card 140 between the secondary clamp structure 142 and the metallic duct. In addition, the secondary clamp structure 142 is illustrated as a plate having a bottom surface that contacts the back side of the expansion card 140, wherein a fastening mechanism such as one or more screws 152 are coupled to the secondary clamp structure 142, the primary clamp structure 138, and a heat sink 154, although other configurations may be used.
In particular, the top edge surface 146 of the primary clamp structure 138 may be positioned adjacent to a chip 148 that is mounted (e.g., via a ball grid array/BGA) near a slot installation edge 150 of the expansion card 140. In fact, another top edge surface can is be positioned adjacent to the chip 148 on the other side of the chip 148, as shown. Accordingly, the illustrated approach provides substantial structural support in an area of the card 140 that may be prone to broken solder joints if the card 140 is subjected to shock forces. Indeed, the placement of semiconductor packages such as the chip 148 adjacent to the slot installation edge 150 may be considered a unique board layout that is enabled by the use of the illustrated clamp structure.
FIGS. 10A-10D show example deflection and stress results that may be obtained using the clamp structure techniques described herein. In particular, FIGS. 10A and 10B show the displacement and stress, respectively, of an expansion card 156 that is clamped by a primary clamp structure 158 that has a relatively wide top edge surface. FIGS. 10C and 10D demonstrate that displacement and stress, respectively, may be significantly reduced if a primary clamp structure 160 is configured to have narrower top edge surfaces that are able to contact the front side of the expansion card 156 directly on alternating sides of any semiconductor packages (not shown) that may be mounted near the edge of the expansion card 156.
Turning now to FIGS. 11 and 12A-12D, an alternative configuration of a clamp structure 168 is shown in which a slot installation edge 162 of an expansion card 166 is clamped by a clamp slot 164. In particular, FIGS. 12A-12C demonstrate that the bottom edge portions of the expansion card 166 not including the slot installation edge 162 can be clamped by a groove 165 formed on the interior of the clamp structure 168. The illustrated slot installation edge 162, on the other hand, is permitted to extend through the clamp slot 164 so that the expansion card 166 may be connected to a mother board (not shown). Thus, the clamp slot 164 includes the aforementioned front edge surface and bottom surface of the clamp structure 168, in the illustrated example.
Thus, the illustrated approach may prevent BGA devices from being susceptible to damaged solder balls and/or pad craters, even if the devices are placed near the slot installation edge of an expansion card. Accordingly, the risk of potential shipping-relate damage can he reduced and/or eliminated.
Secondary Plate
FIGS. 13A and 13B show a circuit board assembly 170 having a secondary plate 172 that is configured to route heat generated on the back side of an expansion card 174 to a heat sink assembly 176 coupled to the front side of the expansion card 174. In general, one or more chips 178 may be mounted to the back side of the expansion card 174, wherein the chips 178 might include heat generating circuits such as memory and/or voltage regulation circuits. Due to tight volume constraints that may prevent the addition of a heat sink to the is back side of the expansion card 174, the illustrated secondary plate 172 collects heat generated from the back side of the expansion card 174 and delivers it to the heat sink assembly 176 on the front side of the expansion card 174.
In particular, FIGS. 14A and 14B show back and front views, respectively, of a secondary plate assembly 180 including a set of heat pipes 184 (184 a, 184 b) that have a direct thermal connection with a corresponding set of copper plates 182 (182 a, 182 b). In general, after assembly with an expansion card (not shown), the heat pipes 184 and one or more chips (not shown) mounted to the back side of the expansion card may be sandwiched between the copper plates 182 and the back side of the expansion card.
In particular, the illustrated secondary plate assembly 180 also includes a carrier plate 186 (made of a material such as aluminum or magnesium) having edges defining one or more chip openings 192, as well as one or more recessed clamped portions 188 that are disposed between the copper plates 182 and the back side of the expansion card after assembly. Thus, the chips mounted to the back side of the expansion card may extend through the chip openings 192 and make a direct thermal connection with the copper plates 182 in one or more regions 190 (as best shown in FIG. 14B) of the copper plates 182. The illustrated heat pipes 184, which have a board height that is approximately equal to the board height of the chips mounted to the second side of the expansion card, also have a direct thermal connection with the copper plates 182. The shape of the chip openings 192, heat pipes 184, copper plates 182, and so forth, may vary depending upon the board layout and the positioning of the chips on the back side of the expansion card. For example, the illustrated heat pipes 184 mirror one another along the lateral axis of the secondary plate assembly 180, whereas the heat pipes of the aforementioned secondary plate 172 (FIGS. 13A and 13B) mirror one another along both the lateral and longitudinal axes.
Accordingly, heat generated by chips, such as chips 178 (FIG. 13B) or supporting components 58 (FIG. 1B), mounted to the back side of the expansion card may travel through the copper plates 182 to the heat pipes 184. As will be discussed in greater detail, the illustrated heat pipes 184 transfer this heat to the front side of the expansion card so that it may be removed via the cooling solution coupled to the front side of the expansion card. In this regard, one or more ends 194 (194 a, 194 b) of the heat pipes 184 may include a bend to facilitate a direct thermal connection between the heat pipes 184 and one or more heat pipes coupled to the front side of the expansion card. The bends could also he located elsewhere along the length of the heat pipes 184.
FIG. 15 demonstrates that notches may be made in an expansion card 196 to provide a pipe opening so that the end 194 of the heat pipe 184 a may make a direct thermal connection is with an end 198 of another heat pipe 200 coupled to the front side of expansion card 196. The illustrated configuration also includes a heat sink 202 coupled to the front side of the expansion card, wherein the heat sink 202 has a direct thermal connection with the heat pipe 200. Accordingly, the heat sink 202 can be used to remove heat generated by chips mounted to the back side of the expansion card 196, although the heat sink 202 is mounted to the front side of the expansion card 196. Such a solution may be particularly advantageous in computing systems having tight volume constraints with regard to the back side of the expansion card 196.
The illustrated solution can also be combined with other solutions described herein, such as, for example, the aforementioned metallic ducts and/or clamp structures to further address cooling and/or structural concerns. For example, the heat pipe 200 might have a direct thermal connection with a flange surface of a metallic duct, a from side clamp structure, and so forth.
FIGS. 16A, 16B and 17 show a fan impeller wheel 204 that may be installed in, for example, the fan 86 (FIG. 4), already discussed. The illustrated fan impeller wheel 204 includes a plurality of blades 206, wherein each blade 206 has a curved span, a pair of curved in board edges 208 (as best shown in FIG. 17) and an outboard edge 210. The distance between the curved in board edges 208 and the outboard edge 210 of each blade 206 may define the span ("s") of the blade 206, wherein the size and curvature of the span of the blade 206 can have a direct relationship to the ability of the blade 206 to move air.
In particular, a larger, more curved span may generate more airflow. In the illustrated example, the curved in board edges 208 have a reduced inner radius ("r") of approximately 25 mm in order to increase the span of the blade 206. While the outer radius defined by the outboard edge 210 could be increased to achieve a corresponding increase in span, such an approach can also increase the outer profile and overall size of the fan, and lead to volume concerns. Accordingly, the illustrated approach may enhance airflow without adding to overall size of the fan. FIG. 18 demonstrates that an outer envelope 212 associated with the outboard edge may be held constant, while an inner envelope 214 associated with the curved in board edges can be moved away from the outer envelope 212 in order to increase the span of the blades.
It has also been determined that the number of blades may impact the ability of the fan to move air. For example, FIG. 19 shows plot 216 in which an approximately one percent increase in airflow can be achieved by reducing the blade count from forty-two blades to thirty-two blades. Indeed, the optimization point of thirty-two blades may provide is unexpected results related to the additional internal volume that can be used to address other geometric parameters such as the aforementioned inner radius of the curved in board edges, blade angle, blade length, and so forth.
The illustrated solution, which may provide stronger airflow at acceptable acoustic levels, can enable better heat sink cooling for expansion cards. The illustrated solution can also be combined with other solutions described herein, such as, for example, the metallic ducts, clamp structures secondary plates, and so forth, to further address volume reduction and/or structural concerns. For example, a centrifugal fan having the illustrated impeller wheel may be incorporated into a metallic duct to provide enhanced structural performance as well as cooling performance.
Power Connector
FIGS. 20-22 show a power connector 218 that can provide a unique volume reduction solution for expansion cards. In the illustrated example, the power connector 218 is coupled to a front side 220 of an expansion card 222 in a "flipped" configuration so that a plug retention mechanism 224 (as best shown in FIG. 22) of the power connector 218 is disposed on a back side 226 of the expansion card 222. In one example, the expansion card 222 has surfaces defining a connector opening 232 (as best shown in FIG. 20), wherein the plug retention mechanism 224 is a protrusion that extends through the connector opening 232. Accordingly, a mating plug 228 may have a corresponding mechanism such as a clip 230 that engages with the plug retention mechanism 224 (as best shown in FIG. 22) if the plug 228 is inserted into the power connector 218.
Disposing the plug retention mechanism 224 on the back side 226 of the expansion card 222 may reduce the board height of the power connector 218 with respect to the front side 220 of the expansion card 222, while maintaining compatibility with the plug 228. In this regard, expansion cards such as the card 222 may have cumulative board height limits/allowances for both the front side 220 and the back side 226 of the expansion card 222. Thus, reducing the board height of the power connector 218 on the front side 220 can enable a heat sink such as the heat sinks 84 (FIG. 4), 136 (FIG. 7B), 154 (FIG. 8), 202 (FIG. 15), already discussed, a fan such as the fan 86 (FIG. 4), already discussed, and/or other cooling components to be increased in height/size in order to achieve a more aggressive cooling solution. Indeed, it is not uncommon for power connectors to consume a substantial portion of the cumulative board height allowance for a given expansion card. For example, if the cumulative board height limit for the front side 220 is about 35 mm, the illustrated configuration could reduce the board height of the power connector 218 by about 4 mm, which may enable a corresponding heat sink height increase of about 4 mm (with all other component heights remaining constant). Since the outer profile of the illustrated power connector 218 does not impact the mating arrangement with the plug 228, the height of the housing of the power connector 218 could also be reduced to achieve further volume reduction benefits. Indeed, it has been determined that an increase in total volumetric flow of about twenty percent may be achieved with the illustrated approach, wherein the total volumetric flow increase can translate into a co-processor thermal design power (TDP) increase of about 7.5 percent. Moreover, the usage of some of the cumulative board height allowance for the back side 226 of the expansion card 222 may be advantageous, even if a low profile cooling solution such as a secondary plate, discussed above, is deployed on the back side 226 of the expansion card 222.
Retention Interlock
Turning now to FIGS. 23 and 24, a mother board 234 is shown, wherein the mother board 234 includes a connection slot 236 and a clip 238 mounted to the mother board 234 adjacent to the connection slot 236. In the illustrated example, the clip 238, which may be constructed from a rigid material such as steel, has surfaces defining a clip aperture 264. As will be discussed in greater detail, an expansion card (not shown) may be plugged into the connection slot 236, wherein the clip 238 and the clip aperture 264 can provide a structural solution that reduces displacement and stress in the expansion card if a shock is applied to the mother board 234 such as a computer system containing the mother board 234 being dropped during shipping.
FIG. 25 shows an expansion card assembly 240 having a front side 242, a left side 244, and a bottom side 246 with a slot installation edge 248 extending from the bottom side 246. A card bracket 250 may be coupled to the expansion card assembly 240, wherein a longitudinal member 252 of an interlock extends through a longitudinal opening in the card bracket 250 and engages with the clip aperture 264 of the clip 238 (FIGS. 23 and 24) if the slot installation edge 248 is plugged into a mother board connection slot 236 (FIG. 23). Turning now to FIGS. 26 and 27, a right side 258, a back side 254 and a top side 256 of the expansion card assembly 240 are shown, wherein a lateral member 260 of the interlock extends through a lateral opening in the card bracket 250. FIG. 28 demonstrates that the interlock may include a spring mechanism 262 that is biased against the longitudinal member 252 so that if the lateral member 260 is used to compress the spring mechanism 262, the longitudinal member 252 can disengage from the clip aperture 264 (FIG. 24) and permit detachment of the expansion card assembly 240 (FIG. 27) from the mother board 234 (FIG. 27).
FIG. 29 shows a plot 266 of BGA shock risk versus dynamic load for a circuit board assembly without a retention interlock ("Option A") and for a circuit board assembly with a retention interlock as described herein ("Option B"). The illustrated plot 266 demonstrates that Option A may range from a marginally passing state to a substantially failing state for a set of dynamic load values that would result in a passing state in all instances for Option B. Indeed, Option B would have significantly more headroom under the marginally passing limit for a dynamic load that may produce a clear failure under Option A.
Embodiments of the present invention are applicable for use with all types of semiconductor integrated circuit ("IC") chips. Examples of these IC chips include but are not limited to processors, controllers, chipset components, programmable logic arrays (PLAs), memory chips, network chips, systems on chip (SoCs), SSD/NAND controller ASICs, and the like. In addition, in some of the drawings, signal conductor lines are represented with lines. Some may be different, to indicate more constituent signal paths, have a number label, to indicate a number of constituent signal paths, and/or have arrows at one or more ends, to indicate primary information flow direction. This, however, should not be construed in a limiting manner. Rather, such added detail may be used in connection with one or more exemplary embodiments to facilitate easier understanding of a circuit. Any represented signal lines, whether or not having additional information, may actually comprise one or more signals that may travel in multiple directions and may be implemented with any suitable type of signal scheme, e.g., digital or analog lines implemented with differential pairs, optical fiber lines, and/or single-ended lines.
Example sizes/models/values/ranges may have been given, although embodiments of the present invention are not limited to the same. As manufacturing techniques (e.g., photolithography) mature over time, it is expected that devices of smaller size could be manufactured. In addition, well known power/ground connections to IC chips and other components may or may not be shown within the figures, for simplicity of illustration and discussion, and so as not to obscure certain aspects of the embodiments of the invention. Further, arrangements may be shown in block diagram form in order to avoid obscuring embodiments of the invention, and also in view of the fact that specifics with respect to implementation of such block diagram arrangements are highly dependent upon the platform within which the embodiment is to be implemented, i.e., such specifics should be well within purview of one skilled in the art. Where specific details (e.g., circuits) are set forth in order to describe example embodiments of the invention, it should be apparent to one skilled in the art that embodiments of the, invention can be practiced without, or with variation of these specific details. The description is thus to he regarded as illustrative is instead of limiting.
The term "coupled" may be used herein to refer to any type of relationship, direct or indirect, between the components in question, and may apply to electrical, mechanical, fluid, optical, electromagnetic, electromechanical or other connections. In addition, the terms "first", "second", etc. might be used herein only to facilitate discussion, and carry no particular temporal or chronological significance unless otherwise indicated.
Those skilled in the art will appreciate from the foregoing description that the broad techniques of the embodiments of the present invention can be implemented in a variety of forms. Therefore, while the embodiments of this invention have been described in connection with particular examples thereof, the true scope of the embodiments of the invention should not be so limited since other modifications will become apparent to the skilled practitioner upon a study of the drawings, specification, and following claims.
1. A circuit board assembly comprising:
an expansion card including a first side and a second side;
a first set of semiconductor packages coupled to the first side of the expansion card;
a metallic duct coupled to the first side of the expansion card, the metallic duct including one or more flange surfaces having a direct thermal connection with one or more of the first set of semiconductor packages;
a second set of semiconductor packages coupled to the second side of the expansion card;
a first heat pipe coupled to the first side of the expansion card, the first heat pipe having a direct thermal connection with the flange surface;
a secondary plate coupled to the second side of the expansion card, the secondary plate having a direct thermal connection with one or more of the second set of semiconductor packages; and
a second heat pipe coupled to the second side of the expansion card, the second heat pipe having a direct thermal connection with the secondary plate, wherein the expansion card includes surfaces defining a pipe opening, and wherein the first and second heat pipes contact one another through the pipe opening.
2. The circuit board assembly of claim 1, wherein the metallic duct includes at least one of a rectangular cross section and a C-shaped cross section.
3. The circuit board assembly of claim 1, further including one or more cooling fins coupled to at least one of an internal surface and an external surface of the metallic duct.
4. The circuit board assembly of claim 1, further including a clamp structure coupled to the second side of the expansion card, wherein the metallic duct further includes a front edge surface that contacts a peripheral portion of the first side of the expansion card and clamps the expansion card between the clamp structure and the metallic duct.
5. The circuit board assembly of claim 4, wherein the clamp structure includes a plate having a back surface, the circuit board assembly further including a fastening mechanism coupled to the plate and the metallic duct.
6. The circuit board assembly of claim 4, wherein the clamp structure includes a back surface associated with a clamp slot and the front edge surface is associated with the clamp slot.
7. The circuit board assembly of claim 4, wherein one or more of the first set of semiconductor packages are mounted via a ball grid array adjacent to a slot installation edge of the expansion card.
8. The circuit board assembly of claim 1, further including a heat sink coupled to the first side of the expansion card, the heat sink having a direct thermal connection with the first heat pipe.
9. The circuit board assembly of claim 1, wherein the second heat pipe has a board height that is approximately equal to a board height of the one or more of the second set of semiconductor packages.
10. The circuit board assembly of claim 9, wherein the second heat pipe and the one or more of the second set of semiconductor packages are sandwiched between the secondary plate and the second side of the expansion card.
11. The circuit board assembly of claim 1, further including a carrier plate having a clamped portion disposed between the secondary plate and the second side of the expansion card.
12. The circuit board assembly of claim 1, further including a centrifugal fan disposed within the metallic duct, the centrifugal fan having an impeller wheel with a plurality of blades.
13. The circuit board assembly of claim 12, wherein each blade of the centrifugal fan includes a curved span and one or more curved inboard edges that have an inner radius of approximately 25 mm.
14. The circuit board assembly of claim 12, wherein the plurality of blades consists of thirty-two blades.
15. The circuit board assembly of claim 1, further including a power connector coupled to the first side of the expansion card adjacent to an edge of the expansion card, the power connector having a plug retention mechanism disposed on the second side of the expansion card.
16. The circuit board assembly of claim 15, wherein the expansion card includes surfaces defining a connector opening and the plug retention mechanism includes a protrusion that extends into the connector opening.
17. The circuit board assembly of claim 1, further including:
a card bracket coupled to the metallic duct, the card bracket having surfaces defining a longitudinal opening and surfaces defining a lateral opening; and
an interlock disposed within the card bracket, the interlock having a first member extending through the longitudinal opening and a second member extending through the lateral opening.
18. The circuit board assembly of claim 17, further including a motherboard having a connection slot and a clip mounted adjacent to the connection slot, wherein the clip includes surfaces defining a clip aperture, and wherein if the expansion card is plugged into the connection slot, the first member of the interlock engages with the clip aperture.
19. The circuit board assembly of claim 18, further including a spring mechanism disposed within the card bracket and coupled to the interlock, wherein if the second member of the interlock is used to compress the spring mechanism, the first member of the interlock disengages with the clip aperture.
20. A circuit board assembly comprising:
a primary clamp structure coupled to the first side of the expansion card;
a secondary clamp structure coupled to the second side of the expansion card, wherein the primary clamp structure includes a front edge surface that contacts a peripheral portion of the first side of the expansion card and clamps the expansion card between the secondary clamp structure and the primary clamp structures;
a first heat pipe coupled to the first side of the expansion card, the first heat pipe having a direct thermal connection with the primary clamp structure, wherein the secondary clamp structure includes a secondary plate having a direct thermal connection with one or more of the second set of semiconductor packages; and
21. The circuit board assembly of claim 20, wherein the secondary clamp structure includes a plate having a back surface, the circuit board assembly further including a fastening mechanism coupled to the plate and the primary clamp structure.
22. The circuit board assembly of claim 20, wherein the secondary clamp structure includes a back surface associated with a clamp slot and the front edge surface is associated with the claim slot.
23. The circuit board assembly of claim 20, wherein one or more of the first set of semiconductor packages are mounted via a ball grid array adjacent to a slot installation edge of the expansion card.
a second set of semiconductor packages coupled to the second side of the expansion card; and
a motherboard having a connection slot and a clip mounted adjacent to the connection slot, wherein the clip includes surfaces defining a clip aperture, and wherein if the expansion card is plugged into the connection slot, the first member of the interlock engages with the clip aperture.
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Owner name: INTEL CORPORATION, CALIFORNIA
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text:
Seneca es un pueblo ubicado en el condado de Shawano en el estado estadounidense de Wisconsin. En el Censo de 2010 tenía una población de 558 habitantes y una densidad poblacional de 5,89 personas por km².

Geografía
Seneca se encuentra ubicado en las coordenadas . Según la Oficina del Censo de los Estados Unidos, Seneca tiene una superficie total de 94.81 km², de la cual 94.61 km² corresponden a tierra firme y (0.22%) 0.2 km² es agua.

Demografía
Según el censo de 2010, había 558 personas residiendo en Seneca. La densidad de población era de 5,89 hab./km². De los 558 habitantes, Seneca estaba compuesto por el 96.59% blancos, el 0% eran afroamericanos, el 1.79% eran amerindios, el 0% eran asiáticos, el 0% eran isleños del Pacífico, el 0% eran de otras razas y el 1.61% pertenecían a dos o más razas. Del total de la población el 0% eran hispanos o latinos de cualquier raza.

Referencias

Enlaces externos

Pueblos de Wisconsin
Localidades del condado de Shawano


text:
VINYL + Cassettes
Madvillain "Madvillainy" Cassette
Title:Cassette
Cassette - $11.00
MF DOOM and Madlib were off the radar to many in 2003, but the announcement of a collaboration and their first track, "America's Most Blunted", brought all the quiet fans out of the woodwork, and let to a controversial and highly acclaimed album release in early 2004 that helped expose the two artists to a large audience for the first time. While the producer and MC both did was what completely natural to them at the time, they turned the formula of popular rap at the time on its head, creating an album that is both unique and true to it's hip-hop influences.
Cover photo by Eric Coleman, design by Jeff Jank.


Home » Blog » We Repair or Replace Dampers!
We Repair or Replace Dampers!
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text:
Home Local News Cable TV office closed, union says workers were locked out
Cable TV office closed, union says workers were locked out
MADAME ESTATE–St. Maarten Cable TV workers who showed up for work on Tuesday were greeted by closed doors and were unable to enter the building, a move their union says was a "lockout" by management that is in contravention of last week's Court ruling.
However, TelEm Group's Chief Executive Officer (CEO) Kendall Dupersoy denies that workers were locked out. He said the company, which took over ownership of Cable TV in October 2016, had initially taken a decision that Cable TV in its present form would be dormant as of January 1. The current temporary closure is in keeping with that plan.
St. Maarten Communications Union (SMCU) President Ludson Evers told The Daily Herald the union had won its injunction against the TelEm Group and that verdict outlined the steps the company now has to take. However, he said when the workers showed up to work on Tuesday they found the offices closed and none of the workers or the union had received any communication from management about the closure.
The union said it followed the necessary steps and was in contact with the Government mediator for information on why the office had been closed.
When contacted for comment, Dupersoy said the initial plans had been to discontinue Cable TV in its present form and incorporate its services into TelEm. He assured that TelEm plans to adhere to the Court verdict and a manpower assessment will be conducted. The Court verdict did not say that the Cable TV office had to remain open, Dupersoy said.
"We are prepared to do what the Court ordered which is to have a manpower assessment done. Maybe it would be best to do this so that the workers of Cable TV and the union can see for themselves that we don't need as many of the workers as they may think we need," he noted.
Dupersoy said the Cable TV office will remain closed temporarily until the manpower assessment has been completed "and we see what we can do from there."
Terms of reference were expected to be completed on Tuesday and sent out requesting quotations for the manpower assessment. Clients are advised to pay their bills and to seek customer service at any TelEm location. If the existing TelEm branches cannot handle the customer service and the payments from existing Cable TV clients, then management might consider reopening the Cable TV office in Madame Estate as a branch office.
Following Hurricane Irma, the number of Cable TV clients dropped from 6,000 to 2,000. Some persons cancelled their subscriptions because they had no roofs, and some had no service due to the damage the Cable TV network suffered during the September hurricanes.
Asked whether workers had been informed about the closure, Dupersoy said that because the verdict had been received late on December 28, the company unfortunately had not had time to discuss the matter with its attorney and had not been able to inform Cable TV workers in a timely manner.
He assured that all workers will continue to be paid until a decision is rendered by the Department of Labour on the company's dismissal request. The company was told that it will receive a decision on its request on March 1.
"A few" of the St. Maarten Cable TV workers have since accepted the termination packages offered by the company and the TelEm group is currently finalising contracts for the local television station to continue its operations moving forward.
Dupersoy said it was "unfortunate" that things had to happen this way. "It was supposed to be a more smoother transition for everyone, but Irma came (almost four) months ago and communication is not what it used to be with union and workers," he said, noting that he had stopped by during a get-together of the workers recently and had spoken and explained certain things about the process to them.
"It was due for them to have this information. I don't know what the manpower assessment will say, so I am waiting on that," he said.
Source: The Daily Herald https://www.thedailyherald.sx/islands/72356-cable-tv-office-closed-union-says-workers-were-locked-out
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Rome (TV series)
Rome station (New York)
Located in the foothills of the Appalachian Mountains, Rome is the largest city in and the county seat of Floyd County, Georgia, on the western border of the state. It is the principal city of the Rome, Georgia, Metropolitan Statistical Area, population 96,250 (2009), which encompasses all of Floyd County. At the 2010 census, the city alone had a total population of 36,303. It is the largest city in Northwest Georgia and the 19th largest city in the state.
Rome was built at the confluence of the Etowah and the Oostanaula rivers, forming the Coosa River. Because of its strategic advantages, this area was long occupied by the Creek and later the Cherokee people. National leaders such as Major Ridge and John Ross resided here before Indian Removal.
The city has developed on seven hills with the rivers running between them, a feature that inspired the early European-American settlers to name it for Rome, the longtime capital of Italy. It developed in the antebellum period as a market and trading city due to its advantageous location on the rivers, by which it sent the rich regional cotton commodity crop downriver to markets on the Gulf Coast and export overseas.
This page contains text from Wikipedia, the Free Encyclopedia - https://wn.com/Rome,_Georgia
Rome is a British-American-Italian historical drama television series created by John Milius, William J. MacDonald and Bruno Heller. The show's two seasons were broadcast on HBO, BBC Two, and RaiDue between 2005 and 2007. They were later released on DVD and Blu-ray. Rome is set in the 1st century BC, during Ancient Rome's transition from Republic to Empire.
The series features a sprawling ensemble cast of characters, many of whom are based on real figures from historical records, but the lead protagonists are ultimately two soldiers, Lucius Vorenus and Titus Pullo, who find their lives intertwined with key historical events. Rome was a ratings success for HBO and the BBC. The series received much media attention from the start, and was honored with numerous awards and nominations in its two-series run. Co-creator Heller stated in December 2008 that a Rome movie was in development, but as of early 2015 no further production had been initiated. The series was filmed in various locations, but most notably in the Cinecittà studios in Italy.
This page contains text from Wikipedia, the Free Encyclopedia - https://wn.com/Rome_(TV_series)
Rome is an Neoclassical train station served by Amtrak. It is located on 6599 Martin Street in Rome, New York between the NY 26-49-69 bridge and Mill Road south of the Erie Canal.
The current station was built between 1912 and 1914 by the New York Central Railroad south of the city proper to replace the former structure downtown. Such a move was necessitated by a track realignment.
The one-and-a-half-story brick building was constructed in a Neoclassical style and includes columns flanking the vestibules, decorative grillwork and large arched windows. The waiting room includes a bowed ticket window and a series of delicate triple-globed bronze chandeliers. At the rear of the waiting room are paired symmetrical staircases with ornate openwork iron railings up to the near platform.
In 1988, Amtrak conveyed the station to the city of Rome. Amtrak proposed to close the station in 1996, but the city resisted and instead found federal funds to renovate the station. The $4 million reconstruction was finished in 2004.
This page contains text from Wikipedia, the Free Encyclopedia - https://wn.com/Rome_station_(New_York)
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Authorities are investigating the attacks as a possible act of terrorism ... The secretary general of Spain's Episcopal Conference, Francisco García, wrote on Twitter that "I have received the news of the incident in Algeciras with great pain." The conference is an organization of Spain's Catholic bishops, based in Rome ... .
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photo: WN / Guillaume Poulet-Mathis
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With only 5 ingredients, including a spice cake mix, this is one easy delicious cake.
Rich chocolate cake and frosting.
Boxed white cake mix is the base of this vanilla cake with creamy goodness and strawberries.
Mama Rene's recipe for nutty coconut cake with cream cheese frosting.


Below are the prices of most of the items from the 2013 Auction that were covered by this blog. The links go back to the original entries, providing further details for reference.
The downloadable version of the 2013 Auction Catalogue has now been moved to the new Archive section. We are leaving it available for reference.
We would like to take this opportunity to thank all the bidders, buyers and, of course, the vendors for helping to make this year's event a success.
We begin taking in items for our 2014 Auction from around October/November. Please feel free to contact us for advice on valuations or placing items for auction with us.
2013 Beatles Auction - a very quick round up.
Everyone here at the Beatles Shop had a feeling that our auction this year was going to be a bit special, and we weren't wrong. There were some brilliant lots and we are really pleased with the prices some of the items fetched for the vendors.
Lots of people have been asking about the door to 20 Forthlin Road, sadly this item failed to reach its reserve price and remained unsold.
However, our other star lot, John Lennon's tie, did sell. The hammer price was £3120. The sale even made Rolling Stone web site! Click here to read the article.
The lot that took us by surprise was one of the Quarry Bank School text books signed out by John Lennon, one of these contained two early Lennon signatures and sold for an amazing £7400. The vendor was in the room and couldn't believe the price. The other, with one signature in, went for £2800. Obviously there's a lot of interest in early signatures and things to do with life pre-Beatles.
The Junior Mastro guitar still in its packaging sold for £2400. Most of the value there is in the packaging, it's unusual to find toys still with their boxes these days.
The set of autographs obtained at the filming of Magical Mystery Tour sold for £4300.
The sets of five autographs featuring both Pete Best and Ringo Starr sold for £4600 and £5500.
These are just the highlights. Once we've fully recovered from Beatle Week there will be a list of prices for the lots we covered in the blog this year.
Unfortunately due to technical problems we are now unable to offer telephone bidding at this year's auction.
PLEASE NOTE LOT 194 HAS BEEN WITHDRAWN.
Below is a list of everything we have covered in the blog this year along with the lot numbers of each items. All the entries have colour photographs of the items and usually a bit more detail about each item.
We have the door from 20 Forthlin Road up for sale in our auction this year. The door was on the former McCartney homestead when the family moved out and the property was sold. Some years later work was done on the house and the door was rescued (with permission) from being thrown away. More recently the door was sold on in auction to the current vendor.
The door comes with a letter of provenance from Mrs Sheila Jones who moved into the house after the McCartneys left. You can read about how the letter was obtained on the Liverpool Echo site.
This is an amazing piece of memorabilia and would certainly be the "conversation piece" in any Beatles collection!
IMPORTANT NOTICE - VAT IS PAYABLE AT 20% ON THE FULL AMOUNT OF THE WINNING BID FOR THIS ITEM.
How do I get into the auction?
Entrance to the auction is by catalogue. This is your ticket in. Catalogues are free and can be picked up from The Beatles Shop once they are available. Also there is usually someone in the Adephi Hotel foyer handing them out on the Friday before the sale and the Saturday morning before we begin. A downloadable version of the catalogue will also be available on this site.
If you are attending the auction and may be looking to bid on any item(s) you must register at the desk before the sale begins. You will need to provide us with contact details and we will give you a bidding paddle with a number on it. You need to be sure the auctioneer has written this number down if you are a successful bidder.
How do I make an absentee bid?
You can use the bidding form on this site, but please contact us if you do not receive an acknowledgement via email that we have received your bid. You can also fax your bid to us on 0113 2779750, or from the USA 0144113 2779750. Or you can email bids to auction@thebeatleshop.co.uk, again please get in touch if an emailed bid is not acknowledged.
Do you accept Overseas Bids?
We certainly do. See above for the contact details for absentee bidders. All bids must be made in Pounds Sterling, not local currency. Overseas bidders will be asked for credit card details to secure their bids, however this does not have to be the method of payment if your bid is successful. Should you be the winning bidder you will be contacted so that payment can be arranged.
If instructed we will execute bids and advise intending purchasers. This service is free. Lots will always be bought as cheaply as is allowed by such other bids and reserves that are on our books. In the event of identical bids the earliest will take precedence. Always indicate a "top limit" - the amount to which you would bid if you attended the auction yourself. "Buy" or unlimited bids will not be accepted. Orders, when placed by telephone are accepted but only at the sender's risk, and must be confirmed before the sale by letter or fax. Fax number for bids only: 0113 2779750, or from the USA 0144113 2779750. Or you can email bids to auction@thebeatleshop.co.uk (please note if you email is not acknowledged after two or three days please resend.
To assist the progress of the sale, all intending buyers are asked to collect a bidding paddle before the commencement of selling. All intended purchasers who are not known to the auctioneers should bring with them some means of identification. The numbered paddle may be used to indicate your bids to the auctioneer during the sale. Should you be the successful buyer of any lot, please ensure that your bid paddle can be seen the auctioneer, and that your number is called out. Should there be any doubts as to price or buyer, please draw the auctioneer's attention to it immediately. All lots sold will be invoiced to the name and address given against the issue of the numbered bid paddle and cannot be transferred to other names and addresses. Please do not mislay your paddle. In the event of loss inform the sales clerk. At the end of the sale please return your paddle to the registration desk. This system does not apply to order bidders.
A buyer's premium of 17% of the hammer price is payable by the buyer's of all lots, this includes VAT.
The pre-sale estimates are intended as a guide for the prospective purchaser. Any bid between the listed figures would, in our opinion, offer a fair chance of success. However all lots, depending on the degree of competition, can realise prices above and below the listed estimates. It is always advisable to consult us nearer the time of sales as estimates can be subject to revision.
Items not collected within five working days (Saturdays included) of the sale will be liable to storage charges.
Payment would be preferred by cash or banker's draft. Buyers are advised that property will not be released until funds have cleared. We are able to accept payment via Mastercard, Visa and Amex subject to the discretion of the auctioneers and authorisation. The service charge of 3% made by these credit companies will be passed on to the user. Payment via debit card occur no extra charge. Purchases may be collected or dispatched upon full payment for the goods. Should shipping be required by the purchaser, costs will be incurred at their expense. All cheques and banker's drafts will be accepted subject to clearance..
To be arranged with the auctioneers. All carriage charges to be paid prior to shipping.
Purchasers are requested to arrange clearance of lots as early as possible and are reminded that purchases are only insured for five days.
Buyers are reminded that all lots are sold as shown, and it is their responsibility to inspect the lot for sale. The absence of reference to condition in the catalogue does not imply that the lot is free from faults or imperfections, unless the lot carries a condition description. Also, unless stated in the description items do not come with letters of authenticity or provenance, nor can such documents be obtained from vendors after the sale. Please note that the auctioneers are not able to provide documentation regarding items sold, unless it has been provided by the vendor when the item was placed into the auction.
BUYERS ARE REMINDED THAT THERE IS A BUYER'S PREMIUM PAYABLE ON THE FINAL BID PRICE OF EACH LOT.
The estimated prices printed below the catalogue descriptions are approximate . They are not definite. They are prepared well in advance of the sale and are subject to revision.
Lot 194 - The US issued White Album number 4 - has been withdrawn from this year's auction.
This is due to circumstances beyond our control and we apologise for any inconvenience this may cause.
We will be contacting those who have placed absentee bids with us in due course.
Due to us getting a few enquiries about placing items into the auction we would like to remind people that the auction is full. We have limited space each year, and usually stop taking items in June at the latest. (This year it was earlier due to the high volume of items we'd already received) This is to give us time to lot up the items and to produce the auction catalogue. You can not turn up with items on the day of the auction and expect them to be entered into the auction.
However, if you have something you would like to enter into next year's auction or simply would like valued then please contact us for valuations and advice. We need a little breather after the auction and Beatles Week to catch up with ourselves and get all the paperwork involved with the sales sorted out, but we start to take items from around October/November. See the FAQ page for any questions you may have about selling your items with us.


The Upward Bound project provides year-round educational intervention programs including weekly after-school meetings, college visitations, cultural activities, and the Summer Discovery Institute. Students must maintain a 2.5 grade point average and complete a minimum of two consecutive summers on the PHCC campus. Enrollment is limited to 66 students who successfully completed the 8th grade and attend Martinsville High School, Magna Vista High School, Bassett High School, or Patrick County High School. Students must be a U.S. citizen or national or permanent resident of the United States.
During the school year, Upward Bound advisors and tutors are in contact with participants, teachers, counsellors, and parents. Advisors visit students at high schools weekly. Students gain information about educational opportunities, receive help filling out college financial aid forms, complete college applications, and preparation for college entrance exams. Participants also have field trip opportunities to visit local colleges.
During the summer, students attend a six week Summer Discovery Institute (SDI). Students participate in academic classes at PHCC, career exploration, electives such as learning a second language, computers, lab science, and study skills, gain focus through cultural activities, field trips, and college visits.
Interested students should complete an "Application of Interest" and return to your guidance office. An advisor will contact you once we receive your completed form.
Upward Bound / Upward Bound Math & Science at PHCC is located in the Walker Fine Arts Student Center.
You may download and print the application.
The PHCC Upward Bound Program is funded through a Federal Grant of $262,000 per year. The grant is from the US Department of Education under Reauthorization of the Higher Education Act - Title IV: TRIO Programs - Upward Bound. This program is authorized to serve 66 students in specific target schools in the city of Martinsville and the counties of Henry and Patrick.