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amaranthus viridis life cycle
Amaranthus caudatus 'Viridis' RHS Plants for Pollinators plants This plant will provide nectar and pollen for bees and the many other types of pollinating insects. Labels: Weeds. Life Cycle - Based on life cycle weeds are classified as annuals, biennials or perennials. Stem solid, glabrous, grooved. Species across the genus contain concentric rings of vascular bundles, and fix carbon efficiently with a C4 photosynthetic pathway. Uses. Identification Notes. Availability: In stock. Amaranthaceae. Leaf axils without paired spines. Summer annuals germinate in the spring, mature, produce flowers and seeds and die before fall. You can get an early start by growing seedlings indoors in late spring. The species were grown by pre-Colombian civilizations, Aztecs, and indigenous US tribes but have mostly been replaced by cereal crops. Synonyms (former Scientific Names): Amaranthus gracilis . Habitat: Grows best in soils with no standing water. Colours include dark red, orange and buff yellow. The leaves of Amaranthus viridis, A. spinosus and A. tricolor are also used as vegetables. long, slender; inflorescence terminal and axillary, the terminal spike-like racemes reaching 2 in. 3. On the growth and chlorophyll content in the leaves of Amaranthus viridis with sowing the seed once a month through the year. broad, ovate or rhomboid-ovate, obtuse, with a short stiff apiculation, narrowed at the base and running into the petiole, glabrous; nerves conspicuous beneath; petioles reaching 1 in. erect, branched; stems grooved, glabrous; leaf-blades 1/4–1 1/2 in. It also grows wild on moist ground, in waste places, or along roadsides. by ; Wild edible plants of Assam. Ambul Ambiliya Oxalis corniculata. The knowledge of spectrum of life cycle of weeds is of immense use towards recommending their control measures. The flowers are green, reduced and grouped in small dense balls. But its suitability as a control agent is hampered by its relatively long life cycle and low reproductive capacity. BASIONYM: Amaranthus lividus Linnaeus, forma pseudogracilis Thellung 1914. Numerous branches emerge from the base, and the leaves are ovate, 3–6 cm long, 2–4 cm wide, with long petioles of about 5 cm. Both wild and cultivated varieties of Amaranthus spp. are infested by the general crop pests like grasshoppers, bugs and beetles. It is hardy to zone (UK) 9 and is frost tender. Most common weeds found in sorghum fields are Amaranthus viridis, Euphorbia macrocephylla, Phyllanthus niruri, Commelina benghalensis among broad leaf weeds; Cyperus rotondus, Cynodon dactylon, Sorghum halepense, Dactyloctenium aegyptium among grassy weeds. Flowers unisexual, green, in cymose clusters; clusters in paniculate spikes about 2.5-12 cm long and 2-5 mm wide, Butachlor applied pre-emergence at 2.0 to 2.5 kg ha-1 gives excellent control. There are 3 types of Muthubeli Bimmal cultivated in Sri lanka; Thai type, American Type and Bhutan Type. Flowers. Habitat: Grows best in soils with no standing water. The life cycle stages of the spinach moth, Hymenia recurvalis (F.) (Lepidoptera: Pyralidae), was studied on the host plant, purple amaranth, Amaranthus blitum L. (Caryophyllales: Amaranthaceae) and adults was fed with 5% honey-solution. Amaranthus hybridus L. is a ... high parameters of resistance (GR50 = 20 900 g ai ha−1, Rf = 314), with all plants completing a normal life cycle even after 32X dose application. 2016. Amaranth varieties that grow head high require 60cm (24 inches) between plants. Native: South America, Asia. 'AMARANTHUS VIRIDIS' SAME FAMILY PLANTS IN 'AMARANTHACEAE' Plant Informant December 11, 2019. Help. by ; Komor, P. & Devi, O.S. Amaranthus retroflexus, true to one of its common names, forms a tumbleweed. It is native to the tropical Americas, but is widespread as an introduced species on most continents in a great number of habitats. pseudogracilis (Thellung) Hugin, Willdenowia 16: 463. Euxolus viridis L. Family. Smaller varieties can be grown in large tubs. ABOUT 'AMARANTHUS VIRIDIS' PLANT Amaranthus viridis. Life Cycle. Amaranthus viridis L. E. slender amaranth. Mix a light application of a balanced organic fertiliser into the soil prior to planting. Biological TypebroadleafCodeAMAVIHabitatterrestrialLife Formannual Bracts are much shorter than flowers. Introduced in many countries, where it is commonly eaten as a vegetable: Euromediterranean region, Western Asia, Central Asia, Russian Far East, India, China, Japan, Indochina, Malesia, most of Africa, USA (south and east), Mexico, Australasia 1. green, Large drooping tassels of flowers. AMARANTHUS caudatus VIRIDIS. pp. i) Annual weeds : weeds, which usually germinate, grow and produce seeds within a season/year and then die-up are called annual weeds. Launaea taraxacifolia and Amaranthus viridis used by people of Western Africa in the treatment of malaria and related symptoms were assessed for their antiplasmodial value against the chloroquine sensitive strain of Plasmodium berghei . Amaranthus Plant Growing and Care Guide. Genus. Multiple resistance has evolved to herbicides in the Groups B/2, and C1/5. Amaranth is a herbaceous plant or shrub that is either annual or perennial across the genus. Inflorescence branched, often tinged red Alternate leaf arrangment A. viridis seedlings Stems are often reddish maroon and striated Leaf apex has short spiny tip Seed (left), fruit (right) About. Associated crops: Winter seasonal vegetables, tobacco, wheat, job, sugarcane etc. Species: Amaranthus viridis L.. Eppo code: AMAVI. Author Affiliation : Plant Pathology and Botany Department, Manipur Agricultural College, Iroisemba, Imphal, Manipur, India. Amaranthus viridis Pall. Life cycle: Generally a plant ... Scientific name : Amaranthus viridis Family : Amaranthaceae Habit: Annual broadleaf, herb. The occurrence of fall armyworm on fodder maize (Zea mays L), Guinea grass (Megathyrsus maximus) (Jacq. Seeds of Amaranthus caudatus are edible. Weed life cycle or ontogeny has made weeds annual, biennial and perennial, three main/broad groups, which are further sub-divided. by Sri Brahmananda Patiri and Sri Ananta Borah, published by the Director Forest Communication, Forest Department, Assam. Post-emergence application of 2_4-D at 500 g/ha. Amaranthus viridis. Code AMAIN Growth form Broadleaf Biological cycle Annual Habitat Terrestrial You can get an early start by growing seedlings indoors in late spring. Amaranthus Seeds - Green Thumb Quick View. Common name - Ambul ambiliya. by ; Wild edible plants of Assam. They are, a. Because tillage greatly alters the environment where weed species survive, altering tillage systems favors certain life cycles over others. by ; Komor, P. & Devi, O.S. are infested by the general crop pests like grasshoppers, bugs and beetles. Major weeds in the Philippines UPLAND WEEDS Scientific name Common name Mode of reproduction Life cycle Morphology Amaranthus Jian-Hua Hao . Leaves glabrous; petioles up to 10 cm; lamina 2-7 x 1.5-5.5 cm. Plant amaranth in late spring or early summer, after the last frost has passed and the soil is warm. Other Common Names: green amaranth. Annual herb, 10-75 (100) cm tall; Stems rather slender, glabrous. Edible bioresources & livelihoods. Leaves. . Our Garden Planner can produce a personalised calendar of when to sow, plant and harvest for your area. 18. alternate, widest near leaf tip, notched. Plant Life Cycle. In the plant life cycle, seed germination is an important development phase, playing a critical role in seedling establishment and overall environmental adaptation [16,17,18]. Leaves are alternate with entire margins. Amaranthus viridis Friche-Joset & Montandon, 1856 Amaranthus viridis Pall. Life Cycle. 1987. Poisonous weeds The poisonous weeds cause ailment on livestock resulting in death and cause great loss. Crude extracts (200 mg/kg) and chloroquine (5 mg/kg) were administered to different groups of Swiss mice. Basic Requirements for Mushroom Cultivation, Introduction to Mushroom Cultivation in Sri Lanka, GAMMA RADIATION SENSITIVITY AND EFFECTIVE DOSAGE FOR SEEDS OF TOMATO VARIETY KATUGASTOTA WILT RESISTANT. The plant has terminal panicles with few branches, and small green flowers with 3 stamens. Amaranthus viridis . General information about Amaranthus viridis (AMAVI) Central America, Caribbean, South America. Common name - Koora Botanical name - Amaranthus viridis Family - Amaranthaceae Life cycle - Annual Morphology. The New York Flora Atlas is a source of information for the distribution of plants within the state, as well as information on plant habitats, associated ecological communities, and taxonomy. Edible bioresources & livelihoods. In early summer, drench plants with a high-nitrogen liquid fertiliser to support vigorous growth. Both wild and cultivated varieties of Amaranthus spp. Weed Research, Japan, 21(1):6-11. Studies on the physiology and ecology of Amaranthus viridis. Taproot white or brown. fluctuating temperature regimes. Habit. They are normally 3-7cm long and ovate in shape. Amaranthus cruentus and A. frumentacea are raised as cereals by primitive tribes in Tropical Asia. Medicinal: Achyranthes aspera is diuretic and purgative. The tap root goes deep in the soil. Amaranthus blitum, commonly called purple amaranth or Guernsey pigweed,is an annual plant species in economically important plant family Amaranthaceae. Share to Twitter Share to Facebook Share to Pinterest. Common name - Koora Botanical name - Amaranthus viridis Family - Amaranthaceae Life cycle - Annual. MaltaWildPlants.com is an internet online database of the wild plants growing on the islands of Malta and Gozo. Chemical insecticides are uneconomical for resource-poor farmers and pose health and environmental risks. Amaranthus viridis Vill. Boiss. Leaves glabrous; petioles up to 10 cm; lamina 2-7 x 1.5-5.5 cm. Tall varieties that produce large seed heads benefit from staking. Flowering generally through out the year. Amaranthus viridis. The damage incidence of 16 to 52% was recorded on fodder maize. direct sow (2) Light Requirements. Germination Response of Four Alien Congeneric Amaranthus Species to Environmental Factors. Amaranthus - Viridis: Botanical Name: Amaranthus caudatus: Life Cycle: Annual: Color: Green: Bloom Season: Summer through Fall: Height: 3-5 Feet: Light Requirement: Full Sun: Sowing Method: Direct Sow: Seeds per Pound: Approx 480,000: Hardiness Zones: All: Ships: Year Around : You May Also Like. Weed Research, Japan, 20(4):153-156 Fractionary distribution of energy in Amaranthus hybridus L. and Amaranthus viridis L. Abstract The green and purple biotypes of A. viridis and A. hybridus were studied at different developmental stages. include Amaranthus viridis, A. gangenticus, A. tricolor and A. hybridus. Amaranthus viridis Amaranthaceae. Qty: gram. In tropical climates, such as Hawaii, they are present throughout the year. A life cycle can be completed in about five weeks in warm climates but may require 3–4 months in cool climates. VERNACULAR NAMES : SINHALA : Kura-tampala TAMIL : Araikkirai. Family Amaranthaceae Genus Amaranthus can be upright or spreading annuals or short-lived perennials, with simple leaves and tiny flowers borne in dense, erect or pendulous, catkin-like inflorescences in summer and autumn Germinates throughout the year if soil moisture is sufficient. Species: Amaranthus viridis L.. Weed type: . Amaranthus hybridus L. 15 One of the world's most common leafy vegetables, this weedy herb originated in tropical America, but is now spread throughout the tropics and is a frequent component of kitchen gardens. Eggs are laid singly in holes in the stems, branches or leaf stalks, and plugged by a green secretion from the weevil. It also grows wild on moist ground, in waste places, or along roadsides. Reproduction, Development and Life Cycle (Wild Animals) - (YY200) ... Amaranthus viridis: host of white rust caused by Albugo candida (Liv). Information from Dichotomous Key of Flora Novae Angliae. Amaranth varieties that grow head high require 60cm (24 inches) between plants. Life cycle: Generally a plant ... Scientific name : Amaranthus viridis Family : Amaranthaceae Habit: Annual broadleaf, herb. Gray) Benth. Read more » at March 18, 2018 No comments: Email This BlogThis! Amaranthus emarginatus subsp. Amaranthus viridis is an annual herb with an upright, light green stem that grows to about 60–80 cm in height. PLOS ONE, Dec 2019 Jian-Hua Hao, Shuang-Shuang Lv, Saurav Bhattacharya, Jian-Guo Fu. Sunflower, Cleome, Zinnia and Nicotiana. 45cm (1' 5") with 60cm (1' 11") row gap (minimum). Life Cycle and Description. 271 (0 ratings) 0. The symptoms and life cycle of this species are given here. Amaranthus viridis All. Similar but less common species. Spoladea recurvalis F. is a major pest moth of amaranth (Amaranthus spp.) Amaranthus lividus L. Family Name: Amaranthaceae - Amaranth Family. Biological TypebroadleafCodeAMAVIHabitatterrestrialLife Formannual Microbial Life Cycles - (ZZ396) ... Amaranthus viridis amaranthus viridis Subject Category: Organism Names see more details, plants plants Subject Category: Organism Names see more details. Amaranthus lividus L. Family Name: Amaranthaceae - Amaranth Family. The larva of these moths is a major defoliator of amaranths in Nigeria and could cause total yield loss. Synonyms. Similar but less common species. Night-flying beetles and other insects often chew holes in amaranth leaves, but the damage is mostly cosmetic. ), para grass (Brachiaria mutica) (Forssk.) Green amaranth (Amaranthus viridis) The most common amaranth in the tropical South Pacific and only found in New Zealand north of the Bay of Plenty, growing in crops and on sand dunes ; A sprawling or partly erect annual plant up to 40 cm high, not very hairy except on the young stems; First observed in New Zealand in 1867. The eggs hatch and the grubs bore into the stems to feed on the pith making zigzag tunnels that become filled with frass (Photos 2-4). ex Wall.. Chenopodium caudatum Jacq.. Galliaria adscendens Bubani. It is important to mention that the most important factor affecting the success of thermal weeding is the life cycle of the weeds, and overall perennial species are more tolerant to flaming than annual species (Rifai et al., 2002). No shikimic acid accumulation was detected in the resistant plants at any of the glyphosate concentrations tested. OR. Slender Amaranth (Amaranthus viridis) is a dicot weed in the Amaranthaceae family. Germinates throughout the year if soil moisture is sufficient. Amaranth can grow to 1.8m (6 feet) tall, so it will dominate a group planting. Koora Amaranthus viridis. The young leaves of most ornamental amaranth varieties can be picked and eaten as cooked greens. In another study, Rifai et al. introduced annual, reproducing from seed. Associated crops: Winter seasonal vegetables, tobacco, wheat, job, sugarcane etc. Used as vegetables. substantial differences in terms of h. 50. between the two. In early summer, drench plants with a high-nitrogen liquid fertiliser to support vigorous growth. Amaranthus caudatus (Inca wheat, love-lies-bleeding) is native to the northern higher-altitude regions of Bolivia, Peru, and Ecuador, whereas Amaranthus cruentus (Purple amaranth) and Amaranthus hypochondriacus (Prince's feather) are native to Guatemala and Mexico. Amaranthus Seeds - Green Thumb Quick View. Stipules absent. annual (6) Bloom Season. Global description: Terrestrial, annual, erect or somewhat prostrate herb, up to 80 cm tall. Species Amaranthus torreyi (A. Add to Cart. October 6, 2015. Synonyms Amaranthus caudatus. Growing season: Rabi and kharif. Flowers. Flowering generally through out the year. Single Plants: 45cm (1' 5") each way (minimum) Gather seed heads for fresh flower arrangements at any stage of maturity. Weed life cycle or ontogeny has made weeds annual, biennial and perennial, three main/broad groups, which are further sub-divided. Family: Amaranthaceae. flowers worldwide, with a potential of causing complete foliage loss under severe outbreaks. green, small, petals absent; axillary clusters, spiny ©2020 University of Massachusetts Amherst • Site Policies. i) Annual weeds : weeds, which usually germinate, grow and produce seeds within a season/year and then die-up are called annual weeds. A. spinosus grows wild. Flowering: Throughout the year. the flower includes only one cycle of petals or sepals ... smooth or slightly wrinkled when dry (vs. A. viridis, with fruit 1--1.6 mm long, rugose when dry). Based on specificity Besides the various classes of weeds, a few others deserve special attention due to their specificity. In no-tillage systems, there has often been a marked drop in the variety of annual species. long, 1/2– 3/4 in. Amaranthus lividus forma pseudogracilis ex Steud. A. spinosus grows wild. View Notes - major weeds in PH.pdf from DAS CRSC 101 at Bicol University. Flowers: End of spring, summer and/or early autumn. ex S. Watson – Torrey's amaranthus P: Species Amaranthus tricolor L. – Joseph's-coat P: Species Amaranthus tuberculatus (Moq.) The subglobose fruit contains only one shiny brown or black seed. smooth, prostrate, ascending tips. Albersia gracilis Webb & Berthel.. Amaranthus acutilobus Uline & W.L.Bray. Plant amaranth in late spring or early summer, after the last frost has passed and the soil is warm. Amaranthus viridis is a ANNUAL growing to 0.5 m (1ft 8in). Life Cycle: Hardy annual. Amaranthus viridis did not show. Life Cycle. Amaranthus hybridus L. 15 One of the world's most common leafy vegetables, this weedy herb originated in tropical America, but is now spread throughout the tropics and is a frequent component of kitchen gardens. by Sri Brahmananda Patiri and Sri Ananta Borah, published by the Director Forest Communication, Forest Department, Assam. Weed species with different life cycles have different requirements for seed germination, seedling establishment, growth, and reproduction. Stems. Tier Prices Buy 50 gram for €0.100 each Buy 100 gram for €0.080 each Buy 250 gram for €0.060 each AMARANTHUS caudatus VIRIDIS is available for purchase in increments of 50 gram. Amaranthus. Influence of light and temperature on germination of five weed species of the Amaranthus genus. Rows: 45cm (1' 5") with 60cm (1' 11") row gap (minimum). Amaranthus gracilis Desf. Glomeraria viridis (L.) Cav.. Lagrezia suessenguthii Cavaco. Koora Amaranthus viridis. Introduction The root knot nematode species, M. incognita, is the most widespread and probably the most serious plant parasitic nematode pest of tropical and subtropical regions throughout the world (Sasser, 1979).It occurs as a pest on a very wide range of crops. The knowledge of spectrum of life cycle of weeds is of immense use towards recommending their control measures. The leaves are alternate and long-petiolated. In Brazil this weed first evolved multiple resistance (to 2 herbicide sites of action) in 2011 and infests Cotton. This is an erect, annual herb reaching a maximum height near 3 m (9.8 ft). include Amaranthus viridis, A. gangenticus, A. tricolor and A. hybridus. Cyclicity. Native … Proximate composition, Amino acids profile, mineral content and antinutritional factors of tender leaves of Amaranthus viridis were evaluated using standard methods of analyses. Flowers vary interspecifically from the presence of 3 or 5 tepals and stamens, whereas a 7-porate pollen grain structure remains consistent across the family. X. Leaf axils without paired spines. smooth, prostrate, ascending tips. Common Names: Amaranth, Tampala, Tassel Flower, Flaming Fountain, Fountain Plant, Joseph's Coat, Love-lies-bleeding, Molten Flower, Prince's Feather, Summer Poinsettia. 2016. cut flowers (6) easy to grow (6) open pollinated (2) Sowing Method. Growing Region: Zones 3 to 10. There are two types: summer and winter annuals. Ikenaga T, Matuo M, Ohashi H, 1975. Used as vegetables. a. pp. Green amaranth (Amaranthus viridis) The most common amaranth in the tropical South Pacific and only found in New Zealand north of the Bay of Plenty, growing in crops and on sand dunes ; A sprawling or partly erect annual plant up to 40 cm high, not very hairy except on the young stems; First observed in New Zealand in 1867. ex Moq.. Amaranthus polystachyus Buch.-Ham. The ability of a species to germinate rapidly under a broad range of environmental conditions has been regarded as a critical trait for invasive species [19,20]. More Views. Harvest seed heads for drying after most of the flowers have faded and the cluster feels firm. In addition, users can learn about the location of vouchered specimens and see images to get a better visual for each plant. Stems rather slender, glabrous. Identifying Characteristics. The adults can survive for months, and will continue to reproduce if fruit is available. Hypolixus trunculatus whose larve tunnel in the stems of A. viridis and form galls, is known from Pakistan, India and Thailand and feeds on A. viridis. Cyclicity. Amaranthus viridis Pollich Common names Amarante verte in French Amaranto verde in Italian Blero blanco in language. early-mid fall (6) early-mid summer (6) mid-late summer (6) Type. green, small, petals absent; axillary clusters, spiny ©2020 University of Massachusetts Amherst • Site Policies. Height: 36 to 100 inches (90 to 250 cm). Slender amaranth is a freely branching, monecious, summer annual that can reach 1m tall. On the germination of Amaranthus viridis. Amazing Flavoured Gin Recipes From the Garden, Recent Innovations in Vegetable Varieties. full sun (6) Height. It is in leaf from April to October, in flower from July to September, and the seeds ripen from August to … baby girl Pyxidium viride (L.) … Poisonous weeds, b. Parasitic weeds and c. Aquatic weeds. Amaranthus - Viridis: Botanical Name: Amaranthus caudatus: Life Cycle: Annual: Color: Green: Bloom Season: Summer through Fall: Height: 3-5 Feet: Light Requirement: Full Sun: Sowing Method: Direct Sow: Seeds per Pound: Approx 480,000: Hardiness Zones: All: Ships: Year Around : You May Also Like. Discussion. and green amaranth (Amaranthus viridis L) is reported first time from Goa, India. Amaranthus viridis L. Amaranthus viridis Pollich ex Moq. Leaves. Stems. Baby Girl Names - Free download as Text File (.txt), PDF File (.pdf) or read online for free. Annuals Annuals complete their life cycle from seed in less than one year. 271 (0 ratings) 0. AMARANTHUS caudatus VIRIDIS. Identification Notes. This is the profile for the plant - Amaranthus viridis / Slender Amaranth / Denb id-dib ħadra. Growing season: Rabi and kharif. Amaranthus viridis is an erect, perennial broadleaf herb, growing up to 75 to 100cm high. Life Cycle. The stems are green, often reddish and angled in cross section. In Mediterranean environments, thermal requirements for seed germination of Amaranthus species are met in spring. Flowering: Throughout the year. alternate, widest near leaf tip, notched. Muthubeli Bimmal are cultivat... Agriculture and Agriculture Related Degrees in Sri... Maha Undupiyaliya Desmodium heterophyllum, Diya Beraliya/Japan Jabara Eichhornia crassipes. FAMILY :-AMARANTHACEAE BOTANICAL NAME:-Amaranthus viridis. pseudogracilis Amaranthus emarginatus Salzmann ex Uline & Bray, subsp. Amaranthus fasciatus Roxb.. Amaranthus gracilis Desf.. Amaranthus littoralis Bernh. Mix a light application of a balanced organic fertiliser into the soil prior to planting. Author(s) : Singh, N. I. introduced annual, reproducing from seed. Albersia caudata (Jacq.) Amaranth cannot tolerate cold temperatures. Hang up in a dry, well-ventilated place. DESCRIPTION : A much branched erect annual stem 30-56 cm tall, cylindrical, glabrous and … €0.100 each. Assam State Biodiversity Board, Guwahati. Assam State Biodiversity Board, Guwahati. Leaves.
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The Young Conservatory actors of the 2017 production of A Christmas Carol.
Mattea Fountain: I live in the East Bay, so it's a solid hour of travel from home to the theater, and then another hour back. Over the course of two months that is hard on me and my family. I usually don't get all eight days of Hanukkah with my family, but I do get to celebrate with my theater family! Each role brings new challenges: learning lines, projecting, learning a new dance—that's what keeps it interesting.
Seth Weinfield: Two-show days can be hard. It's especially hard to keep your energy up for the second show, but a coffee run really helps!
Alejandra Zavala: I have learned to do things that I never imagined I could ever do. For example, twirling my hips as a Turkish fig in a way that makes the audience laugh with joy. A.C.T. has opened my mind to have fun even when I'm put under pressure.
Max Wix: I have learned that if you make a mistake, the adult actors do a really good job of improvising, which makes the audience think that you were supposed to make the mistake all along. Someday, I'll be able to improvise as well as the older actors.


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Riverside body discovery - woman named
Published: 5:59 PM February 6, 2005
POLICE today released the name of a missing woman whose body is believed to have been discovered near to Suffolk's River Lark.Dawn Walker, 36, of Fornham St Martin, was reported missing on Friday, two days after she was last seen.
POLICE today released the name of a missing woman whose body is believed to have been discovered near to Suffolk's River Lark.
Dawn Walker, 36, of Fornham St Martin, was reported missing on Friday, two days after she was last seen.
Her death is still being treated as unexplained. The area around the river, in Fornham Park, near Bury St Edmunds is still sealed off as investigations continue.
The grim discovery was made by a member of the public on Friday evening.
For the full story, see tomorrow's Evening Star.

redpajama_set_name: RedPajamaCommonCrawl


text:
Q: Conditional protocol conformance? I want to do something like this:
class SomeClass<Element> { }
extension SomeClass: SomeProtocol where Element: String { }

It tells me:

Extension of type "SomeClass" with constraints cannot have an inheritance clause.

I could have sworn up to this point that this was one of the bread and butter features of the protocol/extension/generic/associatedtype paradigm. Is there another way to implement this?

A: This was implemented in Swift 4.1.

A: As Paul, you can now do it in Swift 4
protocol Nameable {
    var name:String {get set}
}
func createdFormattedName<T:Nameable>(_ namedEntity:T) -> String where T:Equatable {
    //Only entities that conform to Nameable which also conform to equatable can call this function
    return "This things name is " + namedEntity.name
}

redpajama_set_name: RedPajamaStackExchange


text:
Q: Realtek 0bda:a811 WiFi Driver rtl8812AU on Ubuntu 18.04 Fairly new linux user here, so be gentle. I just installed Ubuntu 18.04 last stable release. Unfortunately, my PC is not near my internet access point, so I have to rely on wifi. I found this answer that references this driver. Before doing their solution, I wanted to try the officially supported rtl8812au driver first, so I downloaded it from here onto a USB from another computer and transferred it to my Ubuntu home folder. I was able to put all necessary dev packages from my install USB into my home folder and run dpkg --install *.deb to install the rtl8812au driver version 4.3.8 and all of its dependencies. I rebooted, but my system still couldn't see my wifi adapter.
I moved forward with the aforementioned stack exchange solution. Upon running those commands, I got this:
here's a picture--sorry I couldn't copy and paste the code.
There appears to be an issue with the definition of the platform_wifi_power functions?
After running dkms status, it shows the new version rtl8812au 4.3.14 has been added, but not installed. I'm stuck here, and I appreciate your help!
EDIT:
I was able to tether to my phone through usb with no fuss at all. I just turned on my personal hotspot and plugged it into usb, booted up, and I was online. This allowed me to run software update and apt update, apt install proper Nvidia drivers, and apt install rtl8812au-dkms. After reboot, my Nvidia drivers are working great now, but I still can't connect to WiFi.
Edit 2:
I tried the proposed solution while tethered to my iPhone so I could do git clone, and I am now connected to wifi! I still don't understand what happened. Literally the only difference was downloading the repo with git clone rather than transferring via USB. Maybe some of the software updates I was able to run while tethered made the difference. Moral of the story for anyone out there: Personal hotspot is your friend!
Edit 3:
For clarity, I want to add that if you try to apt install rtl8812au-dkms first, like I did, you'll have to remove it with sudo apt purge rtl8812au-dkms before you implement the solution below.

A: kernel >= 4.15.0-34
Run these commands to install a working driver:
git clone https://github.com/abperiasamy/rtl8812AU_8821AU_linux.git
cd rtl8812AU_8821AU_linux
sudo make -f Makefile.dkms install
sudo dkms status

The output of the last line should now include:
rtl8812au, 4.3.14, 4.15.0-34-generic, x86_64: installed

reboot


A huge thanks to everyone who made it to our AGM on 19th January. We had a fantastic turnout (much bigger than expected!) and it was great to spend the evening together celebrating the diverse communities that work alongside us.
Special thanks must go to our showcase presenters: to Ricky for sharing the amazing successes of the Sussex Bears Wheelchair Basketball team since he attended our 'Be Funding Bid Ready' training; to Mish for telling us about the inspiring adventures of the Moulsecoomb Bangladeshi Women's group; to Hope, a member of the Coldean Youth Group, who brought the house down with her incredibly moving and accomplished singing performance, a result of her work with the group miss represented; and last, but certainly not least, to Shamsul and all the members of Exercise at the Edge for getting us moving and warming us up at the end of the evening!


text:
Justia Patents Housings (in Addition To Cell Casing)US Patent for Wafer-level optoelectronic device substrate Patent (Patent # 7,288,758)
Wafer-level optoelectronic device substrate
Sep 9, 2005 - Rohm and Haas Electronic Materials LLC
Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.
Latest Rohm and Haas Electronic Materials LLC Patents:
Doping of a substrate via a dopant containing polymer film
Photoacid generator
SALTS AND PHOTORESISTS COMPRISING SAME
Photoresists and methods of use thereof
Copolymer formulation for directed self assembly, methods of manufacture thereof and articles comprising the same
This application is a continuation of application Ser. No. 11/124,775, filed May 9, 2005, which is a continuation-in-part of application Ser. No. 10/192,752, filed Jul. 10, 2002 now abandoned, which is a continuation of application Ser. No. 09/574,482, filed May 19, 2000, now abandoned, which is a continuation-in-part of application Ser. No. 09/199,545, filed Nov. 25, 1998, now abandoned. The contents of each of these applications are incorporated herein by reference.
To date designs and methods of manufacturing photonics transmit/receive modules have relied on complicated techniques of aligning the light emitting and detecting elements, of encapsulating said elements, and of combining the carrier with an optical connector. This is especially true of arrays combining one or more light emitting or detecting devices in parallel. Attempts at handling Vertical Cavity Surface Emitting Lasers or VCSELs and their arrays, as well as photodetectors and their arrays for use in fiber Tx, Rx and Tx/Rx packages have often involved changing the optical axis of the chips—allowing them to interface with v-grooves in a silicon substrate such as in U.S. Pat. No. 5,337,391. Other groups have employed methods to change the optical axis that employ the use of angle polished fiber or flexible waveguide arrays such as Hewlett Packard's Parallel Optical Link Organization (POLO) [Hahn, K. H. PLOL "Parallel optical links for gigabyte data communications", in the Proceedings of the 45th Electronics Components and Technology Conference Proceedings, pgs. 7-8]. Other designs have involved several complicated parts such as U.S. Pat. No. 5,337,398, or have involved the mounting of devices on an optical jumper block such as U.S. Pat. No. 5,719,978 or on the endface of a polished fiber array block such as in the Motorola Optobus [Schwartz, D. B., C. K. Y. Chun, B. M. Foley, D. H. Hartman, M. Lebby, H. C. Lee, C. L. Sheih, S. M. Kuo, S. G. Shook, and B. Webb, 1995, a low cost, high performance optical interconnect. In the Proceedings of the 45th Electronics Components and Technology Conference, pgs. 376-379. Piscataway, N.J.: IEEE]. All of these references are hereby incorporated by reference herein. One prior attempt at monolithic integration using stacks of self aligned chips utilized ball lenses between the stacks to couple optical fibers to the optically active device as was seen in U.S. Pat. No. 5,259,054.
These earlier methods of handling optically active elements, especially surface emitting or receiving devices as arrays—as well as positioning of discrete components—has been very complex, expensive, and lacking in simplicity of design thus making the designs non usuable in the current manufacturing climate. The current invention relates to a new technique for creating a "face-plate" module for handling such active devices. The invention has wide application in making connection to existing and future parallel optical fiber array connectors in its ability to use modified existing ferrules and their alignment mechanisms and accurately align the optical elements of the carrier to the optical fibers.
This eliminates all need for expensive and hard to machine components, costly labor machining and complicated assembly techniques. The device is exceptionally useful for creating cost effective small form factor transceivers and parallel Tx/Rx modules. The invention allows a greater degree of monolithic integration than previously possible and eliminates many of the parts and steps previously required such as optical jumper blocks, polishing operations, etc. Such steps are very expensive to perform and time consuming thus adding to the price of the component member. The invention also will find application in chip to chip and board to board interconnects allowing easier cost effective packaging of the optical elements.
New and existing technologies in micromachining of silicon and other materials allow a greater degree of precision to be obtained in forming cavities and holes in substrates. For example the Bosch process has demonstrated through-wafer etching with excellent control of dimensions at etch rates making new mechanical structures possible. Newer deep dry etching technologies and wet anisotropic technologies—that have already been demonstrated in silicon wafers in conjunction with better encapsulants—make manufacture of these devices possible at this time. It is expected similar etching technologies will become available for other ceramic, glass, injection or transfer molded plastics, and other materials. In addition, parts of the design may find economic manufacture in the future using molding processes, laser machining, light/laser assisted chemical machining, etc.
The devices disclosed are various embodiments of a novel carrier for utilizing one or more optically active devices or elements (here meaning lasers such as VCSELs and VCSEL arrays, photodetectors and photodetector arrays, Light Emitting Diodes or LEDs, Super Luminescent LEDs or SLEDs, etc.) allowing them to be precisely positioned, electrically connected, encapsulated, optionally lensed, and heat sinked. The applications include chip to chip, board to board, and fiber optic and especially fiber optic array transmit, receive and transceiver modules. The approach disclosed can eliminate the need for polishing an assembly to form an optical surface, active alignment of the active optical elements to the carrier, and/or active alignment of the carrier to a connector assembly. Patterned metallizations and solders become incorporated in this design using techniques such as shadow masking, lift-off, selective CVD metal deposition, and can be combined with plating using electroless methods or any of the known electroplating techniques.
The invention disclosed addresses the previously discussed problems inherent in the prior art by providing a simple, easily manufacturable, passively aligned method of coupling an optoelectronic device to a fiber or fiber array with most steps integrated at the wafer level. The passive and self correcting feature of the alignment method provides for an efficient and simple component to be added onto already existing components thus making its incorporation into the manufacturing process a desirable goal.
In fashioning the present invention, the preferred substrate material is a silicon wafer in which many substrate portions can be machined before being diced or cleaved into many components. Other equivalent material may be substituted only if suitable machining technologies are developed. Machining of silicon is a new art form in the manufacture of electronic components on a mass scale and it is precision work.
In a preferred embodiment of the invention, a substrate comprises part of the subassembly—with a precisely machined or formed trench in which the optoelectronic device is placed and aligned, with metallized bond pads and circuit traces to which the device can be electrically connected, with encapsulant filling the trench to encapsulate the device and provide a molded surface for later optical coupling, and with precisely machined or formed through holes or angled edges which serve as alignment guides for alignment fixtures such as pins to come through. The substrate is then placed onto alignment pins of a fiber optic connector housing and bonded to the housing of the connector while the pins hold the substrate in alignment. The pins may later be removed or left in place. The bonded fiber optic connector can be machined or formed to house a back side heat sink and the electrical leads for the optoelectronic device and possibly drivers mounted in the substrate.
In another embodiment, the trench that houses the optoelectronic device can be machined in the back side of the substrate, and a smaller window can be machined in the front of the substrate for the device to show through. In cases where the light to be transmitted or received is at a wavelength where the substrate is transparent, the front side window need not be machined.
In a further embodiment, alignment trenches or grooves are machined or formed into the front or back surface of the substrate so that a fitted cylindrical or spherical object can be inserted. This mechanism allows a new substrate with the same feature (alignment trench) to be aligned to the cylinder or sphere, thereby to also be aligned to the first substrate.
In yet another embodiment, the circuit traces for the optoelectronic device can extend into and through (perpendicular to the surface) the substrate instead of lying parallel to the front or back surface. This allows for simple front to back side electrical connection. The metallized via holes can also be cut in half, allowing electrical connection access to the surface perpendicular to the surface in which the device is mounted. This feature becomes important when it is desirable to affix a flexible circuit member to the subassembly along the edge of the substrate. This feature also allows direct bonding or secondary substrate mounting with a solder bump connection.
In a still further embodiment, the encapsulant that encapsulates the optoelectronic device can be shaped or altered to form lenses, gratings, mirrors, waveguides or other optical elements. This feature allows for beam shaping and/or the redirection of the light to another optoelectronic or waveguiding device. It should be noted that holes can be machined right through the wafer or substrate for insertion of optical fibers adapted to transmit from one side of the wafer or substrate to the other.
In yet another embodiment, an optoelectronic component is provided. The optoelectronic component includes a substrate having a front surface, a back surface and a trench in the front surface, an optoelectronic device in the trench, and an encapsulant contained within the trench. The encapsulant provides an optical surface.
In yet another embodiment, an optoelectronic component is provided. The optoelectronic component includes a planar silicon substrate having a front surface, a back surface and a trench in the front surface, an optoelectronic device in the trench and an encapsulant covering the optoelectronic device. The encapsulant provides an optical surface.
In yet another embodiment, an optoelectronic component is provided. The optoelectronic component includes a planar substrate having a front surface, a back surface and a trench in the front surface, an optoelectronic device in the trench, an encapsulant covering the optoelectronic device, and an optical element inserted into the encapsulant for focusing or reflecting light, or for altering the light transmission qualities of the encapsulant.
A first object of the invention is to provide a simple means of aligning a single or arrayed surface emitting or receiving optoelectronic device to a single or arrayed fiber optic connector.
It is another object of the invention to provide an encapsulated trench for the device that eliminates the need for polishing.
It is yet another object of the invention to provide an improved optoelectronic module.
It is still another object of this invention to provide a innovative method for producing an improved optoelectronic module.
It is yet another object of this invention to provide a superior alignment guide and component for optoelectronic components utilizing guide pins and or beveled surfaces.
It is still another object to provide an improved alignment component for optoelectronic devices which is incorporated directly into the device.
Yet another object of this invention is to provide a method of making optoelectronic components where a large amount of steps are done facilitating wafer level integration of the method.
Still another object of this invention it to provide an optoelectronic component which provides a passively aligned platform for an active device yet still utilizes existing coupling components thus enhancing saved costs.
Further objects include the use of a one time passive alignment and insertion of an optoelectronic carrier and coupler component to an existing assembly and the provision of a superior assembly.
Other objects of this invention include optimal connections of the component to other components such as heat sinks, IC circuits and the like.
These and other objects will become apparent and will be demonstrated in the following drawings and text showing that the disclosed invention offers an easily manufacturable, passively aligned solution to a photonics packaging problem that has only been solved previously by complex or costly designs.
FIG. 1 is a perspective cut-away view of the present invention showing a male connector piece of an optoelectronic subassembly for coupling to the arrayed device on a substrate;
FIG. 2 illustrates a machined or formed trench in a substrate for providing alignment of an optoelectronic device;
FIGS. 3a through 3e illustrate various embodiments of the machined or formed trench in a substrate;
FIGS. 4a through 4c illustrate various embodiments of machined or formed trenches in the back surface of a substrate for the optoelectronic device to be placed face-first within;
FIGS. 5a through 5r illustrate variously shaped through holes which allow for alignment by pins or other cylindrical alignment mechanism;
FIG. 6 illustrates metallized circuit traces and bond pads on a substrate;
FIG. 7 illustrates the addition of a solder eutectic pad and trace on a substrate;
FIGS. 8a, 8e and 8i illustrate various ways to achieve perpendicular circuit access on the edge of a substrate, with FIGS. 8b, 8c and 8d representing cross-sectional features of FIG. 8a, FIGS. 8f, 8g and 8h representing cross-sectional features of FIG. 8b and FIGS. 8j, 8k and 8l representing cross-sectional features of FIG. 8l, as shown;
FIG. 9 illustrates the placement of the optoelectronic device in its alignment trench along with ball wire bonds to metallized pads on the surface of a substrate;
FIG. 10 illustrates the use of a flexible circuit as a means to access the electrical circuit on a substrate, and FIGS. 11a through 11e show the methods for providing metallization and, hence, electrical connection, to the back of a substrate with the use of through holes;
FIG. 12a illustrates the injection of a known volume and subsequent curing of an encapsulant that comes flush to the surface of the trench that houses the optoelectronic device, and FIG. 12b shows a top view of the substrate of FIG. 12a;
FIG. 13a illustrates a different embodiment of the substrate, where the optoelectronic device alignment trench is on the back side of the substrate, and where the device's active area shows through an open window on the front side and FIG. 13b show a top view of the substrate of FIG. 13a. FIGS. 13c and 13d show the metallization and encapsulation for the substrate of FIG. 13a;
FIGS. 14a and 14b illustrate two embodiments of the encapsulation—where the encapsulant can be precisely formed to shape optical elements;
FIGS. 15a through 15c illustrate the method by which a heat sink is placed within an optical connector housing and how the substrate and device subassembly can be simply aligned to the same connector housing—allowing coupling to the connector housing's mating optical connector; and
FIGS. 16a through 16c illustrate the alignment and connection of a fiber optic array connector to a subassembly.
FIG. 1 illustrates a mating part of an optical connector, where the other part of the connector (not shown) is an arrayed or single waveguide or fiber optic connector with fibers or waveguides embedded therein. The connector halves are to be mated by means of the alignment pins 60. The optoelectronic coupler subassembly 195 illustrated is partly comprised of a substrate 29 which has in it a machined or formed trench 23 in which an optoelectronic device 21 is placed, that optoelectronic device being any device which receives or emits light, and especially in, but not limited to, the direction perpendicular to the substrate's 29 front surface. The preferred embodiment of the invention is where the device 21 is a Vertical Cavity Surface Emitting Laser or VCSEL. The device 21 can have ball wire bonds 30 that affix to bond pads on or in the substrate. Electrically conductive traces, bond pads, and solder 24 are deposited onto the surface of the substrate to allow for simple electrical connection from a fanout circuit to the optoelectronic device via ball wire bonds and/or "flip chip" bonding to the traces. The electrically conductive circuits may be metal or may be diffused conductors in the substrate. The bond pads or solder bumps 25 at the top or front of the pictured substrate 29 can be electrically connected to flex circuit, wire bonds, ball grid arrays, or any fitting electrical connector. The trench 23 is injected with an encapsulant 162 which encapsulates the device 21 and can provide a flush, optically flat surface for coupling to the device 21 preferably without the need for polishing. Polishing has been required in the past due to the large amount of machining needed on the surface of the elements. Polished surfaces were needed to insure good face-to-face contact between surfaces and to provide good and complete contact for bonding. The encapsulant can also provide focusing, reflecting, or waveguiding optical elements to redirect light within its confines. The encapsulant can be molded or chemically altered to produce this effect, or a separate optical element can be embedded within its confines. The holes 20 through the substrate 29 are precisely machined or formed to provide precise alignment of the substrate 29 and the device 21 to any alignment pin or tool pushed through the subassembly's holes. Such an alignment tool can be the housing of an optical connector 28 that can have precisely positioned pins 60 for mating to the other half of its connection. The optical connector housing 28 can be machined or formed to accept a heat sink 27 that butts against the back surface of the substrate 29 to conduct heat away from the optoelectronic device 21.
FIG. 2 illustrates the substrate 29 with its machined trench 23 and via holes 20. The trench 23 and the via hole 20 can be machined or formed into the substrate 29 so that they are in precise alignment with one another either through a parallel forming or machining mechanism or through a photolithography step that defines both areas at once, or uses precise mask and mask alignment. Trench 23 has beveled sides 31 all around to provide for both a guiding feature and to allow any encapsulant to form correctly.
FIG. 3 illustrates the various embodiments of the trench formed in the substrate 29 with alignment holes 41. FIG. 3a illustrates a rectangular trench 40 having beveled sides 43 that shows the configuration of the trench if the substrate would be <100> silicon (or formed by means of a mold) and wet anisotropic etching machined the trench. This embodiment 40 also illustrates a smaller trench footprint for later illustration. The trench 42 in FIG. 3b illustrates another trench formed or machined in the same manner as 40, but allowing for two separate optoelectronic device chips to be placed on the substrate along the direction of the width of the substrate due to the configuration of trench 42 which is also formed with beveled sides. Double trenches 44 in FIG. 3c are formed or machined in the same manner as 40, but allow for two separate optoelectronic device chips to be placed in a parallel fashion on the substrate along the direction of the height of the substrate. The rectangular trench 46 in FIG. 3d illustrates the machining or forming of a trench in a different manner—if the substrate would be silicon (or formed by means of a silicon mold) and deep reactive ion etching or DRIE machined the trench (or formed by means of a mold), or if the substrate would be silicon (or formed by means of a mold) and wet anisotropic etching machining the trench which would be a parallelogram. Such a trench does not have beveled sides as shown. The two trenches 48 illustrated in FIG. 3e are formed or machined in the same manner as 46, but allow for two separate optoelectronic device chips to be placed on the substrate along the direction of the width of the substrate. Not pictured is the option of the embodiment of a trench formed or machined in the same manner as 46, but allowing for two separate optoelectronic device chips to be placed on the substrate along the direction of the height of the substrate.
The optoelectronic device can be placed within the trench with its active area facing out of or into or along the surface plane of the substrate.
FIG. 4 illustrates the various embodiments of trenches formed or machined in the substrate for placement of the optoelectronic device into the back surface of the substrate, where the active area faces into the substrate and a window is cut out on the front surface for the active area to show through. Windows are not necessary for wavelengths for which the substrate is transparent to the optoelectronic device. Trench 50 in FIG. 4a illustrates the use of wet anisotropic etching to machine the resultant front trench if the substrate would be <100> silicon (or formed by means of a <100> silicon mold) and the use of DRIE (or formed by means of the same mold) to form the back trench that aligns and houses the optoelectronic device. The result forms a lip 53 which acts as a stop to maintain an optoelectronic device in place and parallel to the disposition of the substrate 29. Trench 52 in FIG. 4b illustrates the use of wet anisotropic etching to machine the resultant front and back trench if the substrate would be silicon (or formed by means of a silicon mold). The result is a beveled front trench 55 and a beveled rear trench 56 which form a lip as shown to provide a guide and stop to hold a component in place. Trench 54 in FIG. 4c illustrates the use of DRIE in the back and front of the substrate (or formed using a mold for the substrate) to provide both trenches, the front trench having an inner surface 58 and the rear trench having a back surface 57 which provide an alignment and stop lip to secure a component in place. Not shown is bonding the active device to the back side without a machining a trench for the device.
FIG. 5 illustrates the various embodiments of the via holes machined or formed into the substrate 29 to provide for alignment to pins or alignment tools. A cut-away side view of a circular hole embodiment is pictured in FIG. 5b with a top cross-sectional view provided in FIG. 5a. This hole 62 is formed or machined via DRIE or laser drilling. The hole 62 is viewed face-on in FIG. 5c with a pin 60 aligned within its edges. A cut-away side view of a diamond shaped hole embodiment 70 is pictured in FIG. 5e with a top cross-sectional view provided in FIG. 5d. The hole 70 is viewed face-on in FIG. 5f with a pin 60 aligned with four points of contact. The hole can be formed or can be machined via DRIE or laser drilling or using a wet anisotropic etch if the substrate material is <100> silicon and the angle of each of the hole's edges is 45° off the major flat angle. The square, straight-walled hole can be machined 45° rotated from what is pictured in 70 if the substrate is <110> silicon. A cut-away side view of a square shaped hole embodiment 78 is pictured in FIG. 5h with a top cross-sectional view provided in FIG. 5g. The hole 78 is viewed face-on in FIG. 5i with a pin 60 aligned with four points of contact. The hole 78 can be formed or can be machined using a wet anisotropic etch. The hole 78 can be formed by entirely etching through the front side 74 of the wafer 29, entirely etching through the back side 76 of the wafer 29, or any combination of depths of either. A front cut-away side view of a square shaped hole embodiment 84 with beveled edges 85 in the front is pictured in FIG. 5k and a back cut-away side view of a square shaped hole embodiment is pictured in FIG. 5l, with a top cross-sectional view provided in FIG. 5j showing the straight and beveled sides 85. One side of the hole 84 can be formed or can be machined using a wet anisotropic etch, while the other can be formed or can be machined using DRIE or laser drilling. As illustrated in FIG. 5n, a diamond shaped hole 70 can be cut to provide two points of contact 90 for pin 60 alignment as in the face-on view FIG. 5m. As illustrated in FIG. 5p, a square hole may be cut to provide three points of contact 92 for pin 60 alignment as shown in the face-on view FIG. 5o. The multiple points of contact provide alignment and centering functions and, when mated back together, form four points of contact with a circular guide pin 60. As illustrated in FIG. 5r, a circular hole may be cut to provide an arc of contact 94 for pin 60 alignment as shown in FIG. 5q. Such an arc contact provides for a press fit of the pin 60 within the hole 62 on substrate 29.
FIG. 6 illustrates an electrically conductive circuit 99 deposited onto or selectively diffused in the substrate 29 with its trench 23 and holes 20. This circuit can provide bond pads 104 for ball wire bonds to the optoelectronic device and/or its drivers. The circuit fans out at 102 to provide easier access to the top bond pads 100. The circuit can include ground plane circuits between signal carrying circuits to provide less crosstalk between signals.
FIG. 7 illustrates an electrically conductive solder pad 106 to allow for flip chip or direct bonding of the optoelectronic device and/or drivers to the substrate 29 with its holes 20 and trench 23. Patterned solders may be made to reflow to provide for alignment of the device with its bottom pads 104 within the trench, or the trench walls used for the alignment.
FIG. 8 illustrates various embodiments of the substrate providing for perpendicular and backside access to the circuits on or embedded in the front surface of the substrate 29 with its holes 20 and trench 23. In the circuits illustrated in FIG. 8a, the edge conductors 110 are formed by anisotropic etching of silicon or forming of some other material into the v-shaped trough 114 and depositing an electrical conductor on or diffusing a conductive layer into the surface. The substrate can then be cut to form two pieces as in FIG. 8c, one of which becomes the chip shown in side cross-sectional view in FIG. 8d with a sloped trough for receiving the array circuit. The edge connection 110 provides perpendicular access to the optoelectronic device's circuits. In the circuits illustrated in FIG. 8e, the edge conductors 120 are formed by anisotropic etching of silicon or DRIE or laser drilling of the substrate material or forming of some other material into the rectangular trough shape 122 and depositing an electrical conductor on or diffusing a conductive layer into the surface. The substrate can then be cut to form two pieces as is shown in FIG. 8g, one of which becomes the chip as is shown in side cross-sectional view in FIG. 8h as a notched trough. The edge connection 120 provides perpendicular access to the optoelectronic device's circuits. In the circuits illustrated in FIG. 8i, the edge metallizations 128 are formed by DRIE through the substrate material or forming of some other material into the shape 130 and depositing an electrical conductor on into the surface. The substrate is then cut to form two pieces as is shown in FIG. 8k, one of which becomes the chip as is shown in side cross-sectional view in FIG. 8l with its concave troughs for termination of the array circuit. The edge connection 128 provides perpendicular and backside access to the optoelectronic device's circuits.
FIG. 9 illustrates the alignment and bonding of the optoelectronic device 21 into the alignment trench 23 of substrate 29. The shape of the trench, with its beveled sides, receives the device and aligns it at the same time, eliminating the need for further alignment. Ball wire bonds 30 affix the electrical connections on the front face of the device 21 to the bond pads in or on the substrate's surface.
FIG. 10 illustrates the use of "flex" circuitry ISO connected to the edge circuit of the array to carry the electrical signals away from the substrate in a protective flexible conductor. The flex circuitry may be connected to the top edge circuit by any of the means heretofore described.
FIG. 11 illustrates the use of via holes 155 to carry the electrical connections for the optoelectronic device to the back surface of the substrate 29 with its rectangular trench 40. FIG. 11a illustrates a cut-away side view, while FIG. 11b illustrates a cross-sectional side view. Various embodiments of the via holes with conductive layers are shown in FIGS. 11c-e. The embodiment of a straight hole 156 shown in FIG. 11c can be formed or can be machined by DRIE or laser drilling. The embodiment shown in FIG. 11d with its hourglass shaped hole 157 can be formed or can be machined by a combination of wet anisotropic etches into silicon, one on the back surface and one on the front surface. The embodiment shown in FIG. 11e with its tapered hole 158 can be formed or be machined by wet anisotropic etch on one surface of a <100> silicon substrate. It should be noted that such deep holes could be made to house optical fibers perpendicular to the surface and that such holes could be made in an array for an opposing chip which would be used to form an independent fiber to fiber or fiber to device connection system.
FIG. 12 illustrates the injection of a known precise quantity of encapsulant 162 to fill flush to the surface of the alignment trench 23. In FIG. 12a, a cut-away side view of the substrate with circuit traces, solder, optoelectronic device, and encapsulant 162 is shown. The side cross-sectional view FIG. 12b illustrates the flat surface achieved by molding the encapsulant 162 flush to the surface of the substrate and curing it.
FIG. 13 illustrates the method by which an optoelectronic device is fitted into the substrate 29 through the back surface trench as defined in 50, FIG. 4a. The device 21 is fitted face-first into the back surface trench of 50 as in the top cross-sectional view FIG. 13b. In FIG. 13c, the back surface face-on view illustrates the conductive circuit traces and solder bond pads 24 for the device 21. In FIG. 13d, the back surface face-on view illustrates the device 21 in place with its back facing out and its active area facing into the substrate. The lip 163 formed by the intersection of bevel 164 and straight side 165 holds device 21 in place in an aligned position.
FIG. 14 illustrates embodiments of the molded encapsulant face to include, but not to limited to, optical elements like lenses and mirrors on a substrate 29. In FIG. 14a, a lens 180, made of a rounded protrusion, spreads the light L coming out of the optoelectronic device 21 if 21 is a light emitting device, or 180 focuses the light L coming into the device 21 if 21 is a light receiving device. In FIG. 14b, the device 186 is a light emitting device like a VCSEL, LED, or SLED, while the device 188 is a light receiving device like a PIN diode. A portion of the light transmitted from 186 reflects off of angular surface 182 into the active area 188, where it is detected. This configuration is useful for monitoring the power of 186. The angle of surface 182 can be calculated to provide for the correct amount of reflected light to impinge upon 188.
FIG. 15 illustrates the fashioning of an optical connector housing 28 that has the same spacing and alignment as a mating connector with fibers or waveguides embedded in it. The optical connector housing 28 has alignment pins 60. It also has a feature such as slot 91 that accepts a protrusion 92 on heat sink 27 into its body so that the optoelectronic device on the substrate 29 can thermally conduct through it. In FIG. 15a, the connector housing 28 and the heat sink 27 are displayed separately. In FIG. 15b, the heat sink and the housing have been assembled, and the optoelectronic coupler subassembly 195 is displayed separately. In FIG. 15c, all the parts have been assembled. The subassembly 195 and the heat sink 27 would be affixed to the connector housing 28, but the pins 60 could be removed once the assembly 195 is bonded in place. The device is ready for connection via solder bumps 25 to an array, a circuit, drivers or the like.
FIG. 16 illustrates, in FIGS. 16a, 16b and 16c the sequence of coupling of a fiber optic array connector 210 to the optoelectronic subassembly 205. The guidepins 60 used to align substrate 29 and component 28 have been removed as the two pieces were bonded. The fiber optic array connector 210 with its flex cord 211 has pins 160 which in turn are inserted into holes 20 of substrate 29 which previously received pins 60 for alignment purposes prior to bonding. Once 210 is inserted into holes 20 the device can be considered complete or it is further bonded together.
The invention herein allows for a large degree of wafer integration. It allows for the use of etching to provide for passive alignment of components within an assembly of components. A large plus to this invention is the utilization of existing components, such as those shown in FIGS. 15 and 16 as 28 and 210 respectively, in the subassembly. This negates the need for expensive manufacture of all new components to achieve this positive passive alignment while at the same time providing a superior platform for the technology. The invention allows for direct bonding of the device to the carrier or other component and for solder or patterned metallizations in the recesses. This allows for flip-chip bonding of pads on the active device to the carrier.
It also allows for possible ground plane metals extending between the traces to help prevent crosstalk in the final module. It also allows for connection to flex (metal conductors in/on a flexible medium) at a distance where there is no interference from the other connector or functions on the face.
The ability to accurately construct the trenches also allows for disposition of a known amount of transparent (can be non-transparent if other optical paths are chosen) encapsulant can be injected to form optical surface. It also allows for the insertion of a filter or other optical elements. This can incorporate coatings to change the reflectivity and transmission such as bandwidth, etc. The use of encapsulant protects against damage due to abrasion, water, and dust to the wire bonds. It is possible to emboss or otherwise shape the encapsulant to form a singular or array of small lenses to optimally couple the light in and out of the system. These can deflect the light to photodiodes to monitor the output of the light. Transparent slides can be inserted into the encapsulant to alter the light transmission qualities thereof.
The silicon wafers can be etched using wet or dry processes. The apertures can be metallized to pass signals from one side of the carrier to the other side. The use of CVD metal deposition and physical vapor deposition at a tilted or variable incident angle is also contemplated. Holes can be etched though the wafers or substrates using isotropic or anisotropic etching giving perpendicular access allowing subsequent metallization of the trenches. The trenches can be filled with solder for connection to another substrate or board and can have pass through connections as described herein from both the edge perpendicular and the opposite side. I.e, the holes can be etched so as to pass electrical connections up to the top edge of the substrate as well as to the opposite side. The etching provides for passive alignment features both in the trench and the holes. A heat sink can be attached to the component with the active portion extending away from the heat generating device which enhances the operation of the sink.
The use of the guide pins and alignment system allows the component to serve as a one time alignment guide to fiber array ferrules which utilizes the mechanics of the fiber array for subsequent matings. The system also allows for board to board free space optical connection. Components having integrated ICs can be connected up as well.
An important consideration is that many of the steps in providing the components are integrated at the wafer level which allows for huge cost savings to be made. This allows also for greater thickness in face plates and requiring only minor changes to be made to the housings which connect and aligns the two ferrules.
Where the operation of devices is 1200 to 1600 nm, the carrier (substrate) is transparent the devices may be mounted facing the carrier in a etched recess. If the carrier is not transparent the cut-out section may be etched so as to be in communication with the trench. In such a case a non-transparent encapsulant may be utilized.
Having shown and described the invention in its many incarnations it will be obvious to those of ordinary skill in the art that many changes and modifications can be made without departing from the scope of the appended claims
1. A wafer-level optoelectronic device substrate, comprising:
a substrate having a plurality of substrate portions, wherein each of the substrate portions comprises an optoelectronic device flip-chip mounted thereon.
2. The wafer-level optoelectronic device substrate of claim 1, wherein the substrate is a silicon wafer.
3. The wafer-level optoelectronic device substrate of claim 1, further comprising an encapsulant over each of the optoelectronic devices.
4. The wafer-level optoelectronic device substrate of claim 1, wherein the optoelectronic device is a light emitting diode.
5. The wafer-level optoelectronic device substrate of claim 1, further comprising a driver in each of the substrate portions.
6. The wafer-level optoelectronic device substrate of claim 1, wherein each of the substrate portions comprises a plurality of optoelectronic devices mounted thereon.
a substrate having a plurality of substrate portions, wherein each of the substrate portions comprises: an optoelectronic device mounted on the substrate; and an electrical conductor extending from a front surface of the substrate to a back surface of the substrate in electrical communication with the optoelectronic device for passing signals to the optoelectronic device.
10. The wafer-level optoelectronic device substrate of claim 7, wherein the optoelectronic device is a light emitting diode.
11. The wafer-level optoelectronic device substrate of claim 7, further comprising a driver in each substrate portion.
12. The wafer-level optoelectronic device substrate of claim 7, wherein each of the substrate portions comprises a plurality of optoelectronic devices mounted thereon.
13. A wafer-level optoelectronic device substrate, comprising:
a substrate having a plurality of substrate portions, wherein each of the substrate portions comprises: a trench in a surface thereof; and an optoelectronic device mounted on the substrate in the trench; and an encapsulant over the optoelectronic device forming a surface thereover, wherein the optoelectronic device substrate has an optical path which passes through the encapsulant surface.
14. The wafer-level optoelectronic device substrate of claim 13, wherein the substrate is a silicon wafer.
15. The wafer-level optoelectronic device substrate of claim 13, wherein the optoelectronic device is a light emitting diode.
a substrate having a plurality of substrate portions, wherein each of the substrate portions comprises an optoelectronic device mounted thereon and an encapsulant over the optoelectronic device, wherein the encapsulant forms a surface over the optoelectronic device and the optoelectronic device substrate has an optical path which passes through the encapsulant surface.
18. The wafer-level optoelectronic device substrate of claim 16, further comprising a driver in each substrate portion.
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Filed: Sep 9, 2005
Assignee: Rohm and Haas Electronic Materials LLC (Marlborough, MA)
Inventors: David W. Sherrer (Radford, VA), Noel A. Heiks (Radford, VA)
Primary Examiner: Que T Le
Attorney: Jonathan D. Baskin
Current U.S. Class: Housings (in Addition To Cell Casing) (250/239); Optical Or Pre-photocell System (250/216)
International Classification: H01J 40/14 (20060101);


We know that the interactions between mums and infants are special and that mums have a unique role to play in helping infants regulate their emotions. Our heart rate projects involve using measures of cardiac output to better understand the physiology underlying mother-infant interactions. In these projects, we record heart rate activity by gently placing small sensors on three points; one at the back of the neck and one next to each collarbone. Previous projects have observed mothers' heart rate activity as they play with their infant in a safe and calm environment, as well as during a resting state during which mums sit and listen to a meditation audio recording.


While the ethics debate has been unequivocally accompanying the progress of Artificial Intelligence (AI) technology, off late the heat around the debate has become even more intense. Interestingly, the dissent around AI ethics for some of the world's leading AI players is coming from very close quarters – their employees.
In the last 2-3 months, Google, Amazon and Microsoft – the trio at the leading edge of AI work – witnessed rebellion from their employees against specific AI projects the companies were working on for the U.S. government and military on the question of ethics involving war and violation of human rights.
It started in April with a section of Google employees protesting against the company's participation in Project Maven, Pentagon's autonomous drone program. The program involves using AI to analyze video imagery, which can help improve the targeting of drone strikes. Google's role in the project was to be around helping the military drones gain the ability to track objects, including interpreting camera footage from the drones.
As per a report published in New York Times in April, around 3,000 Google employees, including some very senior engineers, signed a petition asking CEO, Sundar Pichai, to pull out from the said contract. Few of them even refused to build a security tool required for the project.
The objection to the project was made on ethical and moral grounds as the petition read – "We believe that Google should not be in the business of war." The petition further asks for drafting and enforcing a clear policy that Google will not ever build warfare technology. "The argument that other firms like Microsoft and Amazon, are also participating doesn't make this any less risky for Google," the letter reads further.
The possibility of using AI for creating autonomous weapons has been one of the most fundamental arguments mooted against AI along with the argument around job losses. Some of the most renowned leaders and scientists, including Stephen Hawking and Elon Musk have been very vocal about it with the latter tweeting that a global arms race for AI will cause the third world war. In fact, a group of 116 global technology leaders signed an open letter in August last year calling on UN to ban the development and use of AI weaponry, called 'Killer Robots'.
Coming back to the present day disconcert over AI that is spewing amidst the world's technology giants, Amazon is the latest at the receiving end of employee ire. The company's employees called out for an end to the sale of its facial recognition services, AWS Rekognition, to the U.S. law enforcement agencies over its contribution to violation of human rights.
The employees launched their protest in a letter addressed to CEO, Jeff Bezos, stating that refusal to contribute to tools that violate human rights.
An excerpt from the letter: "We are troubled by the recent report from the ACLU exposing our company's practice of selling AWS Rekognition, a powerful facial recognition technology, to police departments and government agencies. We don't have to wait to find out how these technologies will be used. We already know that in the midst of historic militarization of police, renewed targeting of Black activists, and the growth of a federal deportation force currently engaged in human rights abuses — this will be another powerful tool for the surveillance state, and ultimately serve to harm the most marginalized.
Microsoft too has faced similar dissent from its employees for its work for Immigration and Customs Enforcement (ICE) department, which includes providing cloud services. The contract includes processing data and AI capabilities.
In an open letter addressed to Satya Nadella, over 100 employees asked the company to stop working with the agency for its separation of migrant parents and their children at the border with Mexico, following Trump administration's 'zero tolerance' policy. "We believe that Microsoft must take an ethical stand, and put children and families above profits," the letter read.
In Google's case, even though the company maintained that its products would not create an autonomous weapons system and that its part in Project Maven was 'specifically scoped to be for non-offensive purposes', the powerful protest by its employees has reportedly forced Google to not renew the project once it expires in 2019.
In order to stem any further dissent from employees, in early June Google announced a set of principles it will be using as a code of ethics to abide by when developing future AI.
The seven principles listed are: Be socially beneficial; Avoid creating or reinforcing unfair bias; Be built and tested for safety; Be accountable to people; Incorporate privacy design principles; Uphold high standards of scientific excellence; Be made available for uses that accord with these principles.
Fairness: AI must maximize efficiencies without destroying dignity and guard against bias.
Accountability: AI must have algorithmic accountability.
Transparency: AI must be transparent.
Ethics: AI must assist humanity and be designed for intelligent privacy.
While these principles and codes of ethics exemplify focusing on everything that's good about, the real thrust lies in ensuring that these words are followed to the 'T' and not serve as mere lip service. And, the employees across these tech giants are ensuring that their companies don't err, emerging as the biggest hope for ensuring companies follow the AI ethics. Employees are well on to becoming the new conscience gate keepers for the growing AI ambitions of the technology community.
Strange but true that this technology that aims to shape the future of humanity will create some bitter issues for humanity that will stump us. Issues like unemployment, inequality of wealth, issues of behavioural changes and human-machine interactions, potential barrage of biases, security of both systems and humans, working of robots and their controls are all possible and can stare at the human race. However, the trick is to not let the technology go beyond control and the usage has to be creative not destructive.


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Invitation to join Collaborative Research Network for Law & History (US and non-US)
Via H-Net, the following (terrific) announcement and invitation:
Greetings from the Law & History Collaborative Research Network, part of the Law & Society Association (www.lawandsociety.org/crn.html).
We have just come from the Law and Society Association annual meeting in Minneapolis, where we were thrilled with the success of our first year as a Collaborative Research Network. Creating a CRN, we think, significantly improved the discussion of legal history at LSA. We were able to better coordinate and publicize legal history panels and create new opportunities to interact scholars from other fields. But we hope that this is just the beginning. With more participation, we believe next year will be even better, and we invite you to join us.
What is the Law & History CRN?
The Law & History CRN brings together scholars interested in legal history, both American and non-American, of any time period from contemporary to ancient. We welcome a broad array of scholarly interests and methodological approaches. The Law and Society Movement has long welcomed legal historians and encouraged legal history, and our CRN intends to further foster this relationship. We seek to encourage presentation of historical legal work at the Law and Society's Association's annual meeting, and to create opportunities for interdisciplinary and cross-generational conversations.
What does it mean to join the Law & History CRN?
It means you will be welcomed into a network of scholars interested in participating in the historical examination of the law at the Law and Society Association annual meeting and beyond. In practical terms, joining the CRN means joining a listserv (administered via Google Groups) that we use to alert members of the LSA's call for papers, organize panels, and communicate about panels of interest for scholars interested in law and history at LSA. We will also on rare occasions send out other announcements relevant to legal history.
The next Law & Society Association meeting will be held May 28-31 in Seattle, Washington. The call for papers should be out soon, and the deadline for submitting papers and panels will be in the fall of 2014, so it's not to early to start thinking about proposals.
What are the advantages of joining the Law & History CRN?
We see our main contribution as encouraging connections among a broad range of scholars and drawing attention to the historical legal research presented at the annual conference. More specifically, we're interested in putting together and publicizing legal history panels at the LSA annual meeting. If you have a paper you'd like to present, you can use the listserv to find other potential panelists; we can also use our access to the LSA website to help connect you with other relevant paper submissions. And if you're planning a panel that seems relevant to legal historians, please let us know so that we can list it as a CRN panel (if you're interested) and publicize it among our members. Further, we can make connections with other CRNs, further increasing the potential audience for each panel. This year (our first year as a CRN) we had five panels designated as CRN panels, two of which were co-listed with other CRNs. Finally, the administrative advantage of affiliating your paper/panel with a CRN is that the CRN can request that up to four of CRN-affiliated panels be scheduled at different times to avoid conflicts.
Do I need to be a member of LSA to join the Law & History CRN?
No. We strongly encourage everyone who is presenting at LSA to also become a member, but all we're asking you to do right now is sign up for the email announcements.
I'm not a legal historian/I'm not a historian – can I join?
Absolutely. LSA is about drawing connections across fields and methods. If you're interested in legal history, or you're using historical materials, or you're looking to the past, and you'd like to present on a panel with other people interested in historical sources/methods/questions, we'd love to have you.
I'm already a member of the American Society for Legal History – why should I also attend LSA?
We are all enthusiastic ASLH participants, but the LSA annual meeting differs in a few important ways. First, it's a large interdisciplinary meeting with substantial representation from sociology, political science, anthropology, economics, and other fields. It can thus be a great place to make connections, put together panels across disciplinary lines, and participate in interdisciplinary conversations. Second, since LSA traditionally accepts all paper and panel submissions, it provides a welcoming place for all scholars, especially graduate students who may find it difficult to get on the program at smaller conferences. And third, we want to exchange ideas with scholars interested in legal history more than once a year.
Send an email with your contact information to any or all of us and we will make sure you are included.
Joanna Grisinger, Center for Legal Studies, Northwestern University
joanna.grisinger@northwestern.edu
Kimberly Welch, Department of History, University of West Virginia
Kimberly.Welch@mail.wvu.edu
Logan Sawyer, University of Georgia Law School
lesawyer@uga.edu
Kathryn Schumaker, Institute for the American Constitutional Heritage, University of Oklahoma
kathryn.schumaker@gmail.com
Posted by Mary Stokes at 10:42 AM
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Kroger shares plummet on weak Q4 sales, profits
Rizwan Afzal
CINCINNATI (AP) — Kroger's costly modernization plan may eventually help it compete with retailers like Walmart. But in the meantime, it's a big drag on profits.
The supermarket chain's shares fell sharply Thursday after it reported weaker-than-expected fourth quarter earnings and disappointing guidance for 2019.
At issue is its three-year Restock Kroger initiative, which aims to increase digital sales, equip stores with pickup and delivery, improve store layouts and invest in popular brands. Last year was the first full year of the initiative, and Kroger says it is already seeing some upsides.
Kroger CEO Rodney McMullen noted that the company's natural and organic Simple Truth brand saw sales grow 15 percent to $2.3 billion last year. The company also said digital sales grew 58 percent last year to an annual run rate of $5 billion. It expects that to grow to $9 billion at the end of this year.
Kroger, which also operates Ralphs, Harris Teeter and other stores, said it now offers grocery delivery at more than 2,000 stores and grocery pickup at 1,600 locations. That's more than rival Walmart on delivery, but fewer than the 2,100 Walmart stores that offer grocery pickup.
Adding those services, however, has taken a toll. The Cincinnati chain posted net income of $259 million, or 48 cents per share. That's down from last year's $854 million. Per-share earnings were four cents short of Wall Street expectations, according to a survey by FactSet.
Kroger shares fell more than 12 percent Thursday in its worst day of trading this year.
"We understand and acknowledge that we have our work cut out for us, and the market showed that this morning," McMullen said on a conference call for analysts and investors. "But I want to emphasize that we're incredibly confident about the future of Kroger."
Kroger invested $3 billion last year and expects to at least match that this year. But sales dropped 9.5 percent in the final three months of the year to $28.1 billion, which was also short of analyst projections.
Gross margins, excluding fuel, an extra week in the quarter and other factors, declined 93 basis points from the same period a year ago due to pricing changes and investments in the supply chain. JPMorgan analyst Ken Goldman said that was the biggest decline since the fourth quarter of 2009.
"This suggests deteriorating core supermarket fundamentals, in our view," Goldman wrote in a note to investors.
Kroger's guidance for 2019 also left investors feeling cold. The company said it's targeting net earnings of $2.15 to $2.25 this year, which would be at the lower end of analysts' expectations.
Tags: Cincinnati, consumer products and services, consumer services, corporate news, earnings reports, economy, Financial Performance, Grocery store operators, leading economic indicators, LeadingNews, North America, ohio, Retail and wholesale, retail industry
Trump, Czech Prime Minister Babis have much in common
US stocks fall in afternoon trading, extending weekly losses


Old Mitsui Family Shimogamo Villa is located to the south side of Shimogamo Jinja Shrine. It was established by Hachiro-emon Takamine, the 10th head of the Mitsui Kita Familiy (the head family of all the eleven Mitsui Families), as a villa for all the Mitsui Families. The family had built the Akina Rei-sha Shrine in 1909 in order to enshrine the spirit of their ancestors on this site. Takamine needed a rest house when they visited the shrine and thus commissioned this massive residence in 1925. The family had another residence in the Kiyamachi area and relocated its main building to the present location. The villa was transferred to the country in 1949. From 1951, it served as the housing of the chief of the Kyoto Family Court until 2007. The main building and other extensive residential compounds from the Taisho period (1912-1926) have been maintained in a superb condition and are highly valued as a fine example of a large scale classical Japanese residence. It was designated as an Important Cultural Property in 2011.
The main building hosts a fine garden on the south side which offers an open and bright atmosphere. There is a watchtower on the third floor from which people can enjoy a wonderful view of the Kamo-gawa River and the Higashiyama ridges. It is also considered to be a main structural highlight in the design of the garden as a whole.
* The 2nd and 3rd floors are not open to the public except the sepecial opening period.
The entrance hall was added to the main building when it was relocat-ed. Though the architectural structure follows the classical Japanese Sho-in-zukuri style, the ceiling is high and the interior exhibits the western style as it is furnished with carpets, tables and chairs.
The tea ceremony house facing the garden has a more open and larger space than is common as it has an extra 3-tatami mat room next to the conventional 4.5-tatami mat room. At the rear there is another mini-tea ceremony room so as to make it possible to adapt to any of the tea ceremony styles such as Sencha and Chanoyu (Matcha).
A superb and beautifully tended moss garden spreads out in front of the building. There is a gourd-shape pond on the south side that draws water from the Izumi-gawa stream. The stone bridge is set above the pond to the south, curving stroll paths follow and small artificial hills on which stone lanterns and large Kurama-ishi rocks are distributed.
* The information is based on the website of Cultural Property Preservation Section of Kyoto City and the Mitsui Public Relations Committee.
*Prices shown in ( ) indicate group(more than 20 persons) discounted tickets.
5 minutes walk from Keihan Railway and Eizan Railway Demachiyanagi Sta.


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Microbes in warm soils released more carbon than those in cooler soils
Warming tropical soils could cause a 9% increase in atmospheric CO2 this century
Credit: Andrew Nottingham
As one descends a mountain, the temperature steadily increases. A new study by a team including Andrew Nottingham, a research associate at the Smithsonian Tropical Research Institute (STRI) and post-doctoral fellow at the University of Edinburgh, took advantage of this principle to predict what would happen as tropical soils warm. The team discovered that warmer tropical soils released more car-bon, the species of soil microbes changed and microbial activity increased.
A major cause for concern associated with global warming is the possibility that as soils warm, additional carbon stored in soil organic material may be released into the atmosphere. This would con-tribute to climate warming and warm the soil even more, a 'positive feedback loop,' because global warming is caused by the accumulation of carbon dioxide gas in the atmosphere that traps heat from the sun on the Earth's surface.
"If one accepts the current projections of a 4 to 8 degree Celsius increase in global temperatures during the next century, tropical soils could cause roughly a 9% increase in atmospheric carbon dioxide this century," Nottingham said.
"The fate of soil carbon in response to global heating remains one of the greatest sources of un-certainty in our predictions of future climate," said Patrick Meir of Australian National University in Australia and the University of Edinburgh in Scotland and the project's principal investigator. "Tropical soils have a particularly large influence on the global carbon cycle and are home to unique biodiversity, but their response to warming remains poorly understood."
Accurate predictions of the amount of carbon dioxide in the atmosphere depend upon understand-ing the contributions from different sources. And while tropical forests may have the potential to release vast amounts of carbon into the atmosphere as they warm, the effects of warming on tropical soils and the microbes that break down organic matter are poorly characterized.
At four sites in the Peruvian Andes, Nottingham and colleagues removed soil cores from the ground. A set of cores stayed at the same site, while other cores were moved to sites either higher up the mountain (thus, cooler) or lower on the mountain (warmer), a 3,000-meter range equivalent to plus or minus 4 to 15 degrees Celsius.
"Our study clearly shows that global warming is likely to create a powerful positive feedback loop, as the microbes and enzymes they synthesize that thrive under warmer conditions release even more carbon from the soil into the atmosphere," Nottingham said. "We need to use field experiments to investigate this further, especially in lowland tropical forests."
"Quantifying the likely carbon emissions from warming soils represents a big step forward, made possible through long-term international collaboration," said Ben Turner, co-author and staff scientist at STRI. "This study indicates that tropical soils are likely to be a considerable source of carbon to the at-mosphere, promoting further increases in temperature."
In addition to Turner, the other co-authors were affiliated with the University of Edinburgh, Scot-land; Australian National University; Pontifical Nacional de San Antonio de Abad in Peru; The Centre for Ecology & Hydrology; Lancaster University in the UK; the University of Manchester in the UK; Universidad Nacional de San Antonio Abad del Cusco; and the University of Colorado in the U.S.
The Smithsonian Tropical Research Institute, headquartered in Panama City, Panama, is a unit of the Smithsonian Institution. The institute furthers the understanding of tropical biodiversity and its importance to human welfare, trains students to conduct research in the tropics and promotes conservation by increasing public awareness of the beauty and importance of tropical ecosystems. Promo video.
Elisabeth B King
http://dx.doi.org/10.1111/ele.13379
Tags: Atmospheric ScienceBiologyClimate ChangeClimate ScienceEcology/EnvironmentMicrobiologyPlant Sciences


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Q: HTML CSS/JS Path Error I have two directory in a server: Project A and Project B. In my local development server, both projects work normally. In actual live server, everything is normal in Project A, but this happens to Project B.
My HTML:
<link href="mydir/lib/css/css1.css" rel="stylesheet" type="text/css"/>
<link href="mydir/lib/css/css2.css" rel="stylesheet" type="text/css"/>
<link href="mydir/lib/css/css3.css" rel="stylesheet" type="text/css"/>

But instead it echoed:
<link href="mydir/lib,_css,_css1.css+lib,_css,_css2.css,lib,_css,_css3.css" rel="stylesheet" type="text/css"/>

or
<link href="mydir/A.lib,,_css,,_css1.css+lib,,_css,,_css2.css+lib,,_css,,_css3.css" rel="stylesheet" type="text/css"/>

This happened not only for including CSS, but for JS too. My page CSS display seems normal, but my JS sometimes is not working (undefined functions or variables, but they are already in the included JS files). I don't know if the JS error happened because of this.
Directory name doesn't matter, I tried to change them, sometimes it works, sometimes not. Whether the files actually exist or not doesn't matter too, and again in this case, sometimes it works, sometimes not. Tried not to include or run any JS too, not working. Absolute/relative path doesn't matter too.
This is the first time this happens to me, I couldn't pinpoint why. Does anyone know why this happen and how to fix it?


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Q: Automated EXCEL line chart updating using new inserted data Suppose that I have some date in EXCEL. I need my line plot automatically updated after adding new data. We can Have more(or less) rows (x1,x2, etc.) or more or less columns (years) or both. I want EXCEL automatically update chart by using new inserted data (we don't know new row and column size). How can I do this?

A: Let's say your data looks like this

First you need to convert it to table.

After that yiu are all set, now insert a chart based on this table.
After that, whenever you edit/update your table, the change will be reflected realtime in your chart.
Its that simple.:)


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We will help you get to the next stage of the police hiring process.
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