Ninety percent of high temperature electronic devices operate in temperatures in the range of 150 to 300 °C, and for such temperature needs, technologies typical for the military range might be adapted. To make it possible, new joining techniques are developed, one of them is use of pastes with silver nanoparticles sintered with low temperature joining technique. Silver sintered joints have three times higher thermal conductivity and five times lower electrical resistivity than typical solders, while being able to operate in temperatures reaching 350 °C. In this paper, the authors show the impact of additions of carbon nanoparticles on joints prepared in low temperature joining technology (LTJT). The authors prove that an addition of few percent of graphene nanoplatelets (GNPs) or carbon nanotubes (CNTs) improves joints mechanical, thermal, and electrical properties, while ensuring proper rheology of pastes.