Liquid Metal Jetting is a process in which molten droplets of conductive metal (e.g. aluminum, copper) are jetted onto a substrate at high frequency. This talk will discuss how the process is being used to print circuit patterns. Electrical conductivity, substrate adhesion, cost, and throughput performance metrics will be discussed.
Denis Cormier is the Earl W. Brinkman Professor of Industrial and Systems Engineering at RIT. He has nearly 20 years of experience with metal, ceramic, and polymer based 3D printing processes. He is on the organizing committee for SME's RAPID conference, and he is a founding member of the ASTM F-42 committee that forms standards pertaining to 3D printing and additive manufacturing
While additive manufacturing (AM) and 3D Printing (3DP) technologies have justifiably generated a great deal of excitement, they are only scratching the surface of what's possible. This is because AM and 3DP technologies have typically been used to fabricate purely mechanical parts. But what about parts that require electrical functionality? Or thermal, optical, magnetic, biological, or chemical functionality? RIT's Additive Manufacturing and Multifunctional Printing (AMPrint) Center is among the first research centers in the world to specifically focus on Multifunctional 3D Printing.