Coplanar Microwave Integrated Circuits
Wiley Interscience • 557 pages; $120
The subjects of this book—materials, technology, design and realization of coplanar microwave integrated circuits—combine the research results of a large research group under the leadership of the author. Chapter 1, the introduction, describes the different planar waveguides that can be used in planar microwave circuits, together with their properties, advantages and disadvantages.
The full-wave propagation characteristics of coplanar waveguides are studied in Chapter 2, using rigorous analysis techniques such as the spectral domain analysis that is known to be a fast and accurate computation technique, especially well-suited for the analysis of planar transmission line structures.
A first class of components that are of essential influence in the circuit design are the waveguide discontinuities, such as open and shorted ends, impedance steps, line gaps, waveguide bends, T-junctions and crossings. These elements are investigated in Chapter 3. One of the most important goals of microwave integrated circuits is the reduction of the needed space on the substrate material. Chapter 4 considers coplanar lumped elements, such as capacitors, inductors, transformers and resistors. Chapter 5 offers a coplanar element library and a circuit design program. Chapter 6 deals with coplanar filters and couplers. Whereas the previous chapters have been dealing with coplanar waveguides and components as well as coplanar techniques in general, Chapter 7 is dedicated to coplanar microwave integrated circuits. It starts with a short description of the active elements and their simulation background, after which design examples of coplanar switches, coplanar active filters and coplanar amplifiers are given. A coplanar electronic circulator and a special frequency doubler in coplanar technology are also shown.
To order this book, contact:
John Wiley & Sons Inc.
One Wiley Drive
Somerset, NJ 08875
System-in-Package: RF Design and Applications
Michael P. Gaynor
Artech House • 234 pages; $99, €60
The packaging industry has evolved recently from simple power amplifier modules to full dual-band cellular phone modules. The module advantages are size, cost, yield and ease of assembly.
The system-in-package (SiP) designer has become a full RF transceiver designer, requiring complete RF knowledge of all the functional blocks of the transceiver as well as design for high volume manufacturing, reliability, shield requirements, substrate design rules, substrate performance and cost tradeoffs. The book starts with a brief history of the packaging industry, comparing system-on chip (SoC) to SiP, and concluding with the requirements for the SiP designer. Chapter 2 describes the various substrate options, with emphasis on the main substrates utilized in the low cost wireless module industry, LTCC and laminates. Chapter 3 is devoted to the assembly process, including process flow, component placement, solder paste and reflow, die attach, wirebonding, and die protection. Advanced packaging techniques are described in Chapter 4, including shielding and embedding passive components. SiP is no longer just a simple transistor package or PA module.
Chapter 5 is dedicated to system architecture issues and concerns, while Chapter 6 offers RF design and simulation tips. Some advanced techniques for better RF performance and/or smaller size are given in Chapter 7. Chapter 8 describes a case study and offers thoughts on the field’s future. A WLAN a/b/g complete RF transceiver module including a power amplifier has been designed with a two-compartment shield. The design process first reviewed all identifiable options to meet the design requirements without incurring new technology that would require qualifying in the assembly factory. Five options were identified and the size and cost of each are analyzed.
To order this book, contact:
685 Canton St.
Norwood, MA 02062
(781) 769-9750 ext. 4030; or
46 Gillingham St.
London SW1V 1HH, UK
+44 (0) 207-8750