Buried capacitance technology can increase the performance of printed circuit boards via improved signal integrity. This process incorporates a very thin dielectric layer that provides distributive decoupling capacitance.
- Improved EMI, reliability and manufacturability through glass reinforcement and specialty resins for film-based versions.
- Improved power distribution.
- Reduction of high frequency, discrete bypass capacitors, of undesired discrete capacitor resonance.
- Lower plane inductance at high frequencies.