Surface mount technology (SMT):
This is a method in which components are mounted or placed directly onto the surface of the PCB. The majority of PCB components involve SMT, which was developed in the 1960s and became a common type of PCB assembly in the 1980s.
With this older type of capability, designated pins are inserted into holes and soldered to pads. This type of PCB assembly is still used in a variety of military and consumer applications. Though SMT is more common, some believe through hole is more reliable because it is stronger. This type of assembly is also often used in conjunction with SMT.
This refers to a mounting approach in which the chip is inverted and connected directly to the substrate rather than using the more common wire bonding technique.
In-circuit testing (ICT) and flying probe testing:
Both of these assembly capabilities are used to test the PCB. The ICT machine primarily measures most of the component value. A flying probe test, however, is more common; this checks the continuity of the PCB and is less expensive than an ICT.
To verify and guarantee precision solder joints — along with other aspects of inspection — Cirexx uses state-of-the-art X-ray equipment that allows for real-time inspection and creates images of PCB inner layers, as well as hidden solder joints beneath component housings. These ultra-high-resolution images and movies are among the best in the industry, with the absolute lowest threshold for radiation. Our X-ray inspection is also used for the verification of ball grid arrays (BGAs) and quad-flat no-leads (QFNs).
This type of technology allows a connection between the PCB and plated through hole without the need for soldering.
Mechanical assembly/box build assembly:
This type of capability involves building an electrical device or product by assembling numerous PCBs with other components.
An acrylic-based coating that sometimes covers the hole assembly, this type of coating adds another layer of protection and is often used in military and aerospace applications.
Automatic Optical Inspection (AOI):
This type of inspection uses a piece of equipment that detects each component that is supposed to be on the assembly and confirms their appropriate orientation. It will also look for any defects, examine solder joints, and check whether any components are misaligned.
Selective soldering is the process of soldering thru-hole components by a programmable machine controlling the pre-heat temperature, flux spraying, and soldering time, thereby avoiding heat sensitive components to damage; you can also solder multiple boards faster than hand soldering.
Reballing of components service available:
We also have the ability to reball components if you’re opting to reuse a BGA.