Microstrip patch technology is capable of providing low cost, low profile, and high performance antenna configurations operating over a large spectrum of frequencies. However, a number of technical challenges remain before microstrip antennas can efficiently unite with integrated circuits. This book introduces several novel methods for monolithically integrating and constructing broadband microstrip antennas. Particular focus is placed on the high microwave and millimeter wave frequency range where antenna dimensions are very small and fabrication tolerances are critical. The first stage investigates techniques to reduce the spurious feed radiation and surface wave generation from edge-fed patch antennas. Furthermore, investigation into edge-fed cavity backed patches on high dielectric materials was also conducted. Next, the development of a flip-chip bonding technique was investigated to enhance the fabrication accuracy and robustness of multilayer antennas on high dielectric materials. The final section is focused on developing a fabrication technique to enable the creation of a low permittivity layer at a nominated thickness.