It is the abbreviation of "Chip On Glass" in English, that is, the chip is directly bonded to glass by ACF (Anisotropic Conductive Film). This installation method can greatly reduce the size of the entire LCD module, and is lower cost than the TAB method, and is easy to mass-produce. It is applicable to LCDs for consumer electronic products, such as mobile phones, PDAs, MP3s, and other portable electronic products. This kind of installation is driven by IC manufacturers and is the main connection between IC and LCD today.
Is the English "Chip On Board" abbreviation, that is, the chip is bonding (Bonding) on the PCB, which can greatly reduce the module size, while also reducing costs in terms of price. Since IC manufacturers are reducing the output of QFP (a kind of SMT-type IC, which has four legs) in the production of LCD control and related chips, the traditional SMT method will be used in future products. Gradually replaced.