Low temperature bonding
Nowadays, 100 % glass lab-on-a-chips are manufactured with a high temperature bonding. The main constraint is the required high temperature for the bonding (Pyrex transition temperature = 700°C/ Fused silica transition temperature = 1100°C). High temperature bonding makes instrumentation or embedded technologies delicate because only high temperature fusion materials can potentially be integrated on chips.
Klearia overcomes a major technological limitation by bonding at a low temperature between 100°C and 300°C. Low temperature bonding (≤300°C) allows to integrate more materials for embedded technologies. Thus, Klearia is capable, besides ITO, Pt, Au and Cu, to integrate termodegradable materials like carbon, nanostructured gold, etc.