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Find more information on co-fired
Hard substrates include ceramics
such as alumina, aluminum nitride and beryllium oxide, and are desirable
for applications where bare die (chips) are used such as in a hybrid
module. Ceramics are used because they can withstand the extreme
heat used in wirebonding.
Semiconductor substrates such
as GaAs, InP and silicon are used in manufacturing RFICs.
Some of these numbers came from
Aeroflex, TriQuint, CREE.
Note 1. Anisotropic
dielectric material, Er=9.3 perpendicular to C-axis, 11.5 parallel