ICT: In-Circuit Testing - Test performed on a populated PCB where an electrical probe is used to check the board for errors such as shorts, opens and missing components. A bed-of-nails or a flying probe can be used to run the checks.
LCC: Leadless Chip Carrier - Integrated circuit surface mount package that has pins on all 4 sides of the device. The leads are an integral part of the device with the pins being embedded vertically within the component body equally spaced along the edges.
LGA: Land Grid Array - The LGA is similar to a BGA package in terms of pin placement across the package; however rather that use balls to provide the connection to the PCB it has flat metal pads on the bottom of the device.
Micro-Via: A micro-via also, known as a uVia or µVia, is an extremely small via, 0.15mm (~6thou) or smaller, that is usually laser drilled. The size of the hole is generally governed by the thickness of the dielectric layer that the laser will have to cut through. The vias are commonly used in dense PCB designs.
PCB: Printed Circuit Board - The PCB is a laminated structure that provides the electrical connections between components that are mounted on the board. The connections or tracks are etched from copper clad layers that are then bonded together using heat and pressure. Connections between the layers are created by drilling holes through the board and then plating the holes with copper; these structures are known as vias.
PLCC: Plastic Leaded Chip Carrier - Rectangular Integrated circuit surface mount package that has pins on all 4 sides of the device. The leads are normal J-shaped, bent underneath the body of the device.
Power Connectors: Board-to-board (BTB) connector - Used to connect PCB's (printed circuit boards) (PCB), electronic components in an reliable and repeatable manner.The terminal is made from a conductive material and housed in insulating material to protect from inteference. Terminals transmit the current/signal between PCBs through the connector and so termed BTB.
wire-to-edge power connector
Printed Circuit Technology:
PWB: Printed Wiring Board - See PCB
PWA: Printed Wiring Assembly - See PCB
QFP: Quad Flat Pack - Rectangular Integrated circuit surface mount package that has pins on all 4 sides of the device with its leads formed as gull wing.
SOIC: Small Outline Integrated Circuit - Rectangular Integrated circuit surface mount package that has pins on 2 sides of the device which are formed using the Gull-Wing pattern. The standard pin pitch for a SOIC is 1.27mm/50thou - half that of a standard DIP. The SOIC was the natural replacement for the older DIP (through hole technology) style package and they normally have the same pin-outs as their counterpart DIP devices. There are a number of SOIC package styles such as Wide and Narrow.
SOP: Small Outline Package - Rectangular Integrated circuit surface mount package that has pins on 2 sides of the device that are formed using the Gull-Wing pattern. The standard pin pitch for a SOP is 1.27mm/50thou.
Stackup: The definition of the PCB construction including the number of layers, copper weight (thickness), together with the material type and thickness of the dielectric layers that separate and therefore electrically insulating the copper layers from each other; the stackup will also stipulate the final PCB overall thickness. The design of the stackup is a critical factor in defining the board's performance and should be carried out with the fabricator.