Ball Grid Array (BGA) refers to a particular type of surface mount assembly which is used to permanently mount devices, such as microprocessors, to printed circuit boards. A BGA has a number of advantages over other methods and as such, it has become a popular technique used in the manufacturing of integrated circuits and electronic devices.
A common form of electronic manufacturing, ball grid arrays derived from pre-existing pin grid array (PGA) technologies. Instead of utilising pins to conduct electrical signals from the circuit board, a ball grid array makes use of tiny drops of solder.
These balls of solder are placed evenly apart on the board in an array, or symmetrical grid and gently heated in a specialist oven. Surface tension ensures that the components are kept in position.
Our assembly capabilities and machinery allows us to work on a diverse range of BGA assemblies and is capable of working with a pitch down to 0.3mm on your printed circuit board.